Etching device and wafer one side etching method
A technology for etching devices and wafers, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increasing the production cost of semiconductor chips, reducing the production efficiency of semiconductor chips, and scrapping wafers, etc.
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[0041] As mentioned in the background, when the wafer is etched by wet method in the prior art, the efficiency is low and the cost is high.
[0042] In view of this, an embodiment of the present invention provides an etching device, which is applied to wafer wet etching, including:
[0043] base;
[0044] A plurality of clip rings arranged on the base, at least two wafers are placed between adjacent clip rings, and the surface to be etched of the wafer faces the adjacent clip rings , and the clip ring is circular, and its side wall includes at least one liquid inlet groove;
[0045] A clamping device arranged on the base, the clamping device is used for clamping a plurality of clip rings and a plurality of wafers placed on the base.
[0046] Correspondingly, the embodiment of the present invention also provides a single-side etching method of a wafer, which is applied to the etching device described in the above embodiment, including:
[0047] placing a plurality of said cl...
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