Semiconductor device

A technology of semiconductors and devices, applied in the field of semiconductor devices with capacitors, can solve the problems of reduced voltage resistance of capacitor insulating films and the like

Inactive Publication Date: 2016-01-06
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent Document 6 discloses that the withstand voltage of a capacitive insulating film can be lowered by this electric field

Method used

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  • Semiconductor device
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Embodiment Construction

[0048] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, the same reference symbols are assigned to the same constituent elements, and duplicate descriptions thereof are omitted.

[0049] figure 1 is a plan view showing the configuration of the semiconductor device SD according to the embodiment. figure 2 is used figure 1 Magnified view of the area enclosed by the dotted line α. image 3 is a cross-sectional view showing the configuration of the semiconductor device SD according to the embodiment. image 3 The left side corresponds to the figure 2 A cross-sectional view cut by the line A-A'.

[0050] Such as image 3 As shown, the semiconductor device SD has a substrate SUB, a transistor TR1 and a capacitor CP. The transistor TR1 is formed over the substrate SUB. Capacitor CP is electrically connected to transistor TR1. The capacitor CP includes a first electrode EL1 (lower electrode...

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Abstract

A semiconductor device having a capacitor which includes a first electrode electrically coupled to a transistor and a second electrode separate from the first electrode and covered with an interlayer insulating film, in which a plurality of coupling holes are formed in the interlayer insulating film and are in contact with the second electrode at the lower ends; and, when the capacitance of the second electrode is represented by C[nF] and the total area of the lower ends of the coupling holes is represented by A[[mu]m2], the following expression (1) is satisfied. C / A<=1.98 [nF / [mu]m2] (1) The elution of the second electrode constituting the capacitor at the lower ends of the coupling holes is suppressed.

Description

[0001] Cross References to Related Applications [0002] The disclosure of Japanese Patent Application No. 2014-130052 filed on Jun. 25, 2014 including specification, drawings and abstract is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to a semiconductor device, for example, to a technique applicable to a semiconductor device having a capacitor. Background technique [0004] A capacitor is an electronic device that accumulates charge and is used in, for example, DRAM (Dynamic Random Access Memory). As for the capacitor, there are cases where a large capacitance is required. As the surface area of ​​the capacitor increases, the capacitance of the capacitor will become larger. Therefore, in order to obtain a capacitor having a large capacitance, the surface area of ​​the capacitor can be made large. [0005] Meanwhile, it is now desired that the area of ​​the semiconductor chip be small. In order to form a capaci...

Claims

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Application Information

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IPC IPC(8): H01L27/108H01L23/64
CPCH01L23/5223H01L23/53295H01L2924/0002H01L28/87H01L28/91H01L23/5226H10B12/315H10B12/0335H01L2924/00H01L27/0629
Inventor小泽健国岛浩之
OwnerRENESAS ELECTRONICS CORP