Dynamic thermal conductivity system

Abstract

The invention relates to a dynamic heat conduction system, which includes a base, an elastic device, a heat conduction module and at least one fixing piece. The base accommodates the elastic device and the heat conduction module, and restricts at least a part of the heat conduction module and the elastic device in the base through the at least one fixing member. The heat conduction module has a heat conduction surface for bonding with an electronic component, so that the heat energy of the electronic component is conducted to the base through the heat conduction surface through the heat conduction module and the heat conduction side wall of the heat conduction module, thereby achieving a better heat conduction effect. Moreover, the dynamic heat conduction system of the present invention may also include a heat conduction plate to accommodate a plurality of bases and heat conduction modules, so as to simultaneously utilize multiple heat conduction modules and bases on the heat conduction plate and a plurality of electronic components with different shapes or sizes to form a better heat conduction path.

Description

technical field [0001] This case is about a dynamic heat conduction system, especially a dynamic heat conduction system applied to computer devices. Background technique [0002] In computer devices, in order to keep the computer devices operating at an appropriate temperature, a heat conduction device with a heat conduction module is usually used, and the heat conduction module is closely attached to the electronic components that generate a large amount of heat energy to quickly conduct heat from the electronic components to the heat conduction device. [0003] In order to make the heat conduction module on the heat conduction device closely adhere to the processor, a traditional method is to place a thermal pad (Thermal Pad) in the gap between the heat conduction module and the processor. A certain amount of deformation is generated at the same time, so that the heat conduction sheet is closely attached to the heat conduction module and the processor at the same time. H...

AI Technical Summary

Problems solved by technology

However, the traditional heat conduction module has the following disadvantages: the deformation of the heat pipe may cause the heat pipe to fail; the cost of the heat pipe and spring screws is relatively high; it is not easy to adapt to the assembly of electronic components of different heights; it is difficult to maintain the heat conduction module and the electronic components The tight fit; and the heat conduction structure has no cushioning, which is easy to cause damage to electronic components in a vibration environment

Therefore, the heat conduction module of the existing heat conduction device obviously has its inconvenience and lack in practical application, and it can be improved

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