Substrate plate structure and manufacturing method thereof

Abstract

A substrate plate structure and a manufacturing method thereof, wherein the substrate plate structure comprises: a substrate plate body which has a first surface and a second surface opposite to the first surface, and at least two conductive blind holes which pass trough the first and second surfaces; at least two first circuits which are formed on the the substrate plate body and extend to end parts of the at least two conductive blind holes, and the width of each of the first circuits on the end part of a conductive blind hole is less than the width of the end part of the conductive blind hole; and at least one second circuit which is formed on the substrate plate body and passes through between the at least two first circuits on the end parts of the at least two conductive blind holes. Thereby, the allocation quantity and wiring density of the circuits can be increased; the manufacture procedure of the substrate plate structure is simplified; and cost is reduced.

Description

technical field [0001] The invention relates to a substrate structure and its manufacturing method, in particular to a substrate structure and its manufacturing method in which circuits are formed on the ends of conductive blind holes. Background technique [0002] As electronic products tend to be thinner and smaller and their functions continue to increase, the circuits on the substrate structure also tend to be denser, so the spacing of these circuits is shrinking, the number of configurations is increasing, and the wiring density is also increasing. high. [0003] Figure 1A and Figure 1B A schematic cross-sectional view and a partial top view of a substrate structure 1 in the prior art are respectively shown. As shown in the figure, the substrate structure 1 includes a substrate body 10 , a first build-up structure 11 , a second build-up structure 12 , two conductive blind holes 13 , two first circuits 14 and at least one second circuit 15 . [0004] The substrate b...

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Problems solved by technology

[0009] However, the above Figure 2A and Figure 2B The disadvantage of the substrate structure 1' is that although the substrate structure 1' can increase the arrangement quantity and wiring density of the first lines 14 and the second lines 15, the substrate structure 1' needs to additionally produce a first build-up structure 11 (or with the addition of the second build-up structure 12), the conductive blind holes 13, the first lines 14 and the second lines 15 can be formed on the first build-up structure 11, resulting in the substrate structure 1' being relatively complex in manufacturing process. complex and expensive

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