An enhanced heat dissipation liquid cooling radiator

Abstract

The invention discloses a liquid-cooled radiator with enhanced heat dissipation, and aims to provide a liquid-cooled radiator which can effectively reduce the flow resistance and increase the heat dissipation per unit volume of the radiator. It includes a sealed working chamber composed of a bottom plate and an upper cover. The bottom plate is an evaporation chamber; there are multiple heat dissipation units, multiple rib columns and partitions parallel to the bottom plate in the working chamber. The first flow channel, the second flow channel is formed between the partition plate and the bottom plate, the first flow channel communicates with the second flow channel to form a coolant flow channel, and there is a liquid inlet on the upper cover opposite to the first flow channel, opposite to the second flow channel There is a liquid outlet on the upper cover; each heat dissipation unit is composed of a connected adiabatic chamber and a condensation chamber, the adiabatic chamber is located between the partition and the bottom plate, and the condensation chamber is located above the partition; the lower end of the adiabatic chamber communicates with the evaporation chamber; the bottom plate There are multiple rib columns that pass through the bulkhead. The heat sink can effectively maintain the temperature of the cooled device within a safe range, and realize the miniaturization of the heat sink.

Description

technical field [0001] The invention relates to the technical field of thermal energy engineering heat dissipation, in particular to a liquid cooling heat dissipation device used for heat dissipation of high heat flux density devices. Background technique [0002] With the increasing integration of electronic components, the heat dissipation of single equipment and the whole machine of high heat flux devices in the fields of electronic product equipment, aerospace, energy and chemical industry has increased sharply, and the cooling problem of high heat flux devices has become a constraint for related fields. The biggest obstacle to a technological leap. The traditional heat dissipation method is mainly based on air cooling, and other heat dissipation methods include liquid cooling, heat pipe heat dissipation, semiconductor refrigeration, and micro refrigeration system cooling. Among them, air cooling and liquid cooling are the most common and cheap cooling methods for high h...

AI Technical Summary

Problems solved by technology

Traditional liquid cooling heat dissipation is mainly through processing a large number of heat-conducting ribs with different shapes on the bottom plate of the evaporator, which not only increases the flow resistance of the liquid and the volume of the radiator itself, but also increases the power consumption of the circulating pump, and heat transfer The effect is not good, and hot spots are prone to appear on the surface of heating components, which limits the further application of liquid cooling radiators

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