Stripping device and stripping method of laminated body, and manufacturing method of electronic device
A stripping device and a technology for a laminated body, which are applied in the fields of semiconductor/solid-state device manufacturing, chemical instruments and methods, electrical components, etc., and can solve problems such as the inability to insert the knife edge reliably.
Active Publication Date: 2019-03-19
ASAHI GLASS CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Since the cutting edge with a chipped edge cannot be reliably inserted into the next interface, there is a problem that the peeling start part that contributes to peeling at the interface cannot be reliably made at the next interface.
Method used
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Embodiment Construction
[0048] Embodiments of the present invention will be described below with reference to the drawings.
[0049] Hereinafter, the case where the peeling apparatus and peeling method of the laminated body of this invention are used in the manufacturing process of an electronic device is demonstrated.
[0050] Electronic devices refer to electronic components such as display panels, solar cells, and thin-film secondary batteries. Examples of the display panel include a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel.
[0051] Manufacturing process of electronic devices
[0052] Electronic devices are produced by forming functional layers for electronic devices (thin-film transistors (TFTs) and color filters (CFs) in the case of LCDs) on surfaces of substrates made of glass, resin, or metal.
[0053] Before forming the functional layer, the ...
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Abstract
The present invention relates to a peeling apparatus for a laminate which is a rectangular laminate having a first substrate and a second substrate to be able to be detachable therefrom. The peeling apparatus for a laminate makes peeling at an interface of the first substrate and the second substrate comprises a peeling knife which has a flat plate shape, has the end of a blade on an edge part, and has a certain amount of the end of the blade inserted into the interface from the corner part of the laminate to form a peeling starting part on the interface; a peeling means making peeling at the interface starting from the peeling starting part; an insertion position changing means changing the relative position of the peeling knife and the laminate on a plane; and a control means controlling the insertion position change means to change the insertion position of the end of the blade of the peeling knife inserted into the interface.
Description
technical field [0001] The present invention relates to a peeling device and a peeling method of a laminate, and a method of manufacturing an electronic device. Background technique [0002] With thinner and lighter electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinner substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are expected. [0003] However, if the thickness of the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (thin film transistor (TFT: Thin Film Transistor) and color filter (CF: ColorFilter)) on the surface of the substrate . [0004] Therefore, a method of manufacturing an electronic device has been proposed in which a reinforcing plate (second substrate) is pasted on the back surface of the substrate to form a laminate in which the substrate is reinforced b...
Claims
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IPC IPC(8): B32B43/00B32B38/10H01L21/67
CPCB32B38/105B32B43/006H01L21/67092
Inventor 伊藤泰则宇津木洋滝内圭
Owner ASAHI GLASS CO LTD