Threaded hole processing method for PCB (printed circuit board)

Abstract

The invention provides a threaded hole processing method for a PCB (printed circuit board), which comprises the steps of hole routing and thread tapping, wherein a ball type routing machine is adopted to carry out hole routing at the position where a heat dissipation copper block is inlaid in a PCB with a copper sheet, and a thread tap with a chip removing slot is adopted to carry out thread tapping on a through hole of the PCB so as to acquire a threaded hole used for fixing the heat dissipation copper block. The threaded hole processing method provided by the invention for the PCB can process a threaded hole in an epoxy resin PCB with the thickness reaching up to 5mm, the processed threaded hole of the PCB is high in precision, and the processing qualified rate of the PCB is ensured. The threaded hole can be processed in the PCB, so that a screw thread can be processed at the periphery of the heat dissipation copper block correspondingly, and the heat dissipation copper block is enabled to be locked on the PCB through the screw thread, thereby avoiding a problem that overall heat dissipation of the PCB is affected because of untight, loosened or even falling-off connection between the heat dissipation copper block and the PCB.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a threaded hole processing method for a PCB board. Background technique [0002] With the rapid development of the electronics industry, the miniaturization and modularization of electronic products has become a major trend in the current development. The degree of integration and density is getting higher and higher. , server power supply products, wireless base stations, etc., along with the miniaturization, the problem of heat dissipation has become an urgent problem to be solved. The traditional heat dissipation solution has disadvantages such as large space occupation and poor heat conduction efficiency, and cannot meet the requirements of miniaturization. At present, the use of copper paste plug holes or copper blocks instead of dense heat dissipation holes is the main way to improve the heat dissipation performance of PCB boards for PCB boards with a thickne...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that in the existing PCB board using plugged copper block for heat dissipation, due to the poor connection between the PCB aperture tolerance and the copper block, the copper block is prone to loosening or even falling off, resulting in poor heat dissipation effect of the PCB board The disadvantage is to provide a threaded hole processing method for the PCB board, which locks the copper block in the threaded hole processed by the PCB board to ensure the tight connection between the copper block and the PCB board

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