A threaded hole processing method for pcb board

A PCB board and processing method technology, applied in the field of threaded hole processing for PCB boards, can solve problems such as loose connection, loose or even falling off of copper blocks, poor heat dissipation effect of PCB boards, etc., and achieve the effect of ensuring pass rate and high precision

Active Publication Date: 2018-05-11
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that in the existing PCB board using plugged copper block for heat dissipation, due to the poor connection between the PCB aperture tolerance and the copper block, the copper block is prone to loosening or even falling off, resulting in poor heat dissipation effect of the PCB board The disadvantage is to provide a threaded hole processing method for the PCB board, which locks the copper block in the threaded hole processed by the PCB board to ensure the tight connection between the copper block and the PCB board

Method used

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  • A threaded hole processing method for pcb board
  • A threaded hole processing method for pcb board
  • A threaded hole processing method for pcb board

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see figure 1 , which is a threaded hole processing method for a PCB board provided by the present invention. The threaded hole processing method is mainly a processing method specifically used for PCB boards whose board thickness is more than 5mm and the material is epoxy resin. Adopting the threaded hole processing method provided by the present invention can reasonably and effectively realize the processing of threaded holes on the PCB, and ensure that the precision requirements of the processed threaded holes have met the tolerance requirements for being able to embed heat-dissipating co...

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Abstract

The invention provides a threaded hole processing method for PCB boards, comprising the following steps: drilling: adopting a ball-type drilling machine to perform drilling on the position where a heat dissipation copper block is inlaid on a PCB with copper skin; tapping: adopting The through hole of the PCB board is tapped by a tap with a chip removal groove to obtain a threaded hole for fixing the heat dissipation copper block. The invention provides a threaded hole processing method for a PCB board, which can process threaded holes on a PCB board with a thickness of more than 5 mm and a material made of epoxy resin. The threaded holes of the processed PCB board have high precision, ensuring that the PCB The qualified rate of plate processing. Because the threaded holes can be processed on the PCB, the outer edge of the heat dissipation copper block can be processed with threads correspondingly, so that the heat dissipation copper block can be locked on the PCB board through the thread, so as to avoid loosening or even falling off of the heat dissipation copper block and the PCB board if the connection is not tight And affect the overall heat dissipation of the PCB board.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a threaded hole processing method for a PCB board. Background technique [0002] With the rapid development of the electronics industry, the miniaturization and modularization of electronic products has become a major trend in the current development. The degree of integration and density is getting higher and higher. , server power supply products, wireless base stations, etc., along with the miniaturization, the problem of heat dissipation has become an urgent problem to be solved. The traditional heat dissipation solution has disadvantages such as large space occupation and poor heat conduction efficiency, and cannot meet the requirements of miniaturization. At present, the use of copper paste plug holes or copper blocks instead of dense heat dissipation holes is the main way to improve the heat dissipation performance of PCB boards for PCB boards with a thickne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 张军杰彭卫红刘克敢张国城
Owner SHENZHEN SUNTAK MULTILAYER PCB
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