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Damascus integrated etching machine cavity and substrate part

A technology for etching machines and substrates, which is applied to electrical components, discharge tubes, circuits, etc., and can solve problems such as deep depth, difficulty in eradication, and damage to side walls and bottom coatings.

Inactive Publication Date: 2016-02-10
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During each PM (Periodic Maintenance), in order to completely remove the remaining products in the cavity, the industry currently manually removes the products adhering to the side walls and bottom, especially TiN, which is highly viscous and difficult to remove; and because The cavity itself has a large area and a deep depth. It takes two manpower and about 2 working hours to clean it thoroughly each time. In addition, if the side wall and the bottom of the cavity are removed for a long time, the coating on the side wall and bottom will be damaged. For a process as delicate as Damascus integration, there are potential risks

Method used

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  • Damascus integrated etching machine cavity and substrate part
  • Damascus integrated etching machine cavity and substrate part
  • Damascus integrated etching machine cavity and substrate part

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Embodiment Construction

[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0025] Such as Figure 1 to Figure 5 As shown, the present invention provides a Damascus integrated etching machine cavity, including: a cavity body 10, process components disposed inside the cavity body 10, and disposed in the cavity body 10 and connected to the cavity body 10 The cavity body 10 matches the substrate part 20 . The process components are used to perform the integrated etching process of damascene, that is, to perform the steps of opening-removing-removing-grooving in the cavity body 10...

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Abstract

The invention discloses a Damascus integrated etching machine cavity. The Damascus integrated etching machine cavity comprises a cavity body, process components arranged in the cavity body and a substrate part arranged in the cavity body and matched with the cavity body. The invention also provides the substrate part mounted in the cavity body of the Damascus integrated etching machine cavity and matched with the cavity body. By additionally arranging the substrate part in the cavity body, the inner wall and the bottom of the cavity body can be protected to avoid products from adhering to the inner wall and the bottom of the cavity body, so that multiple workers for removing the products that are adhered to the side wall and the bottom for many hours are not required.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a Damascus integrated etching machine cavity and substrate components. Background technique [0002] The TELVigus machine is the world's most advanced Damascus integrated etching machine, which has three complicated processes (opening-removing-grooving) completed in the same reaction chamber, and the products produced are complex, especially TiN, It is difficult to completely drain the cavity through the molecular pump, and most of the TiN-containing products will adhere to the side walls and corners of the cavity. [0003] During each PM (Periodic Maintenance), in order to completely remove the remaining products in the cavity, the industry currently manually removes the products adhering to the side walls and bottom, especially TiN, which is highly viscous and difficult to remove; and because The cavity itself has a large area and a deep depth. It takes two manp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32477H01J37/32495
Inventor 汤介峰潘无忌刘东升吕煜坤朱骏张旭升
Owner SHANGHAI HUALI MICROELECTRONICS CORP