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Electronic load testing device

A technology for testing devices and electronic loads, which is applied to measuring devices, measuring electricity, and measuring electrical variables, etc., and can solve problems such as poor heat conduction

Inactive Publication Date: 2016-02-17
致茂电子(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is to provide an electronic load testing device to improve the common problem of poor heat conduction between t

Method used

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  • Electronic load testing device
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Experimental program
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Embodiment Construction

[0060] Please refer to Figure 1 to Figure 3 . figure 1 It is a three-dimensional schematic view of the electronic load testing device according to the first embodiment of the present invention. figure 2 for figure 1 External schematic diagram. image 3 for figure 1 Schematic diagram of the internal breakdown.

[0061] The electronic load testing device 10 of this embodiment is a dual-channel model, and can be used for at most two power supplies (not shown) to perform electronic load testing. The electronic load testing device 10 includes a housing 100, a connection interface assembly 200, a first load circuit assembly 300, a second load circuit assembly 400, a first heat dissipation assembly 500, a second heat dissipation assembly 600, a first control The circuit assembly 710 , a second control circuit assembly 720 , a fan 900 and an insulation assembly 800 .

[0062] The casing 100 is made of metal, for example. The casing 100 includes a first casing 110 and a second...

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Abstract

The invention discloses an electronic load testing device, which comprises a shell, a connection interface assembly, a first load circuit assembly, a first cooling assembly and an insulation assembly, wherein the connection interface assembly is arranged on the shell and is electrically insulated with the shell; the first load circuit assembly comprises a first circuit board and multiple first load wafers, the first circuit board is electrically connected with the connection interface assembly, and the first load wafers are electrically connected with the first circuit board; the first cooling assembly is located inside the shell, and the first load wafers are directly and thermally contacted with the first cooling assembly; and the first cooling assembly is combined on the shell via the insulation assembly to enable the first cooling assembly to be electrically insulated with the shell.

Description

technical field [0001] The invention relates to an electronic load testing device, in particular to an electronic load testing device for improving heat dissipation efficiency. Background technique [0002] Electronic load testing devices include single-channel models and multi-channel models. Single-channel models are available for single-channel DUT testing. The multi-channel model can be used for multiple single-channel DUT testing, or for multi-channel DUT testing. Therefore, for users who need multi-channel testing, the test cost of using a multi-channel model is actually less than that of using a single-channel model. [0003] The dual-channel model includes at least two load circuit modules and a heat sink. The two load circuit modules conduct heat to the heat sink to reduce the operating temperature of the two load circuit modules. However, in order to prevent the circuits of the two negative circuit modules from interfering with each other due to the common conta...

Claims

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Application Information

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IPC IPC(8): G01R31/00
Inventor 陈文钟蒋兴文李秋贞刘崇琳黄建兴
Owner 致茂电子(苏州)有限公司