Fabrication method of flexible substrate, fixing method and fixing structure

Abstract

The invention discloses a fabrication method of a flexible substrate, a fixing method and a fixing structure. The fabrication method comprises the following steps: coating a glass support plate with a flexible substrate material with weak glass adhesion; coating the edge of the flexible substrate material with a material with strong glass adhesion, so as to fix the edge of the flexible substrate material on the glass support plate; directly defining an effective region on the flexible substrate material, and processing the effective region; and cutting the flexible substrate material and taking down the effective region. The edge of the flexible substrate material with the weak glass adhesion is coated with the material with strong glass adhesion; after the flexible substrate material is fixed on the glass support plate, the effective region can be directly defined on the flexible substrate material; and the effective region of the flexible substrate does not need to be controlled by virtue of the size of a release layer, so that the manufacture procedure is simplified.

Description

technical field [0001] The invention relates to the field of flexible electronic components, in particular to a structure of a flexible substrate and a manufacturing method thereof. Background technique [0002] Such as figure 1 and figure 2 As shown, the current practice of flexible substrates is mainly to first form a release layer 22 on the glass carrier 21, and define the effective area of ​​the flexible substrate 23 based on the release layer 22, and then fabricate a flexible substrate with high glass adhesion on it. The substrate 23 and the flexible substrate 23 are high temperature resistant flexible materials, including PEN (polyethylene naphthalate), PI (polyimide film) and their derivatives. The effective area of ​​the flexible substrate 23 is controlled by controlling the sizes of the release layer 22 and the flexible substrate 23 . After the electronic assembly is fabricated, the active area of ​​the flexible substrate 23 is removed along the cutting line 24 ...

AI Technical Summary

Problems solved by technology

[0003] However, the existing method is to use the release layer 22 to define the effective area of ​​the flexible substrate, which will cause the selection of the material of the release layer 22 and the complexity of the manufacturing process. In addition to the increase in the cost of an additional layer of release layer 22, When removing the effective area, laser is also used to complete the separation of the release layer 22 and the flexible substrate 23, which greatly increases the difficulty of the process

Therefore, the existing flexible substrates for flexible electronics have complex structures and low process yields.

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