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Semiconductor device

A semiconductor and conductive type technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of increased wiring resistance, achieve the effect of suppressing the increase of wiring resistance and reducing on-resistance

Inactive Publication Date: 2016-02-17
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the wiring area is reduced, sometimes the wiring resistance increases

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

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Embodiment Construction

[0013] Embodiments will be described below with reference to the drawings. The same reference numerals are attached to the same parts in the drawings, and the detailed description thereof will be appropriately omitted, and different parts will be described. In addition, the drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, and the like are not necessarily the same as those in reality. In addition, even when the same part is shown, the mutual dimension and ratio may be shown differently depending on drawing.

[0014] Furthermore, the arrangement and structure of each part are demonstrated using the X-axis, Y-axis, and Z-axis shown in each drawing. The X axis, the Y axis, and the Z axis are perpendicular to each other, and represent the X direction, the Y direction, and the Z direction, respectively. In addition, the Z direction may be described as upward and the opposite direction may be desc...

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Abstract

A semiconductor device includes a semiconductor layer having a first surface and a second surface opposed to the first surface, a control electrode provided on the second surface side of the semiconductor layer, and a conductor provided on the second surface which is electrically connected to the control electrode. The conductor includes a first portion provided on the second surface, and at least one second portion reaching from the first portion into the semiconductor layer.

Description

[0001] (References for related applications) [0002] This application is based upon and claims the benefit of priority based on prior Japanese Patent Application No. 2014-164683 filed on Aug. 13, 2014, the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments described herein relate generally to semiconductor devices. Background technique [0004] In response to demands for efficient power usage, energy saving, and the like, it is required to reduce the on-resistance of semiconductor devices used for power control and the like. In order to reduce the on-resistance, it is effective to increase the device area on the chip, but the chip size will increase. Among the semiconductor devices, for example, there are semiconductor devices having wirings electrically connected to control electrodes. In the case of such a semiconductor device, it is possible to reduce the on-resistance by reducing the wiring area and widening the element...

Claims

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Application Information

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IPC IPC(8): H01L23/522
CPCH01L21/3065H01L21/3083H01L23/535H01L21/743H01L2924/0002H01L29/4238H01L29/42376H01L29/66734H01L29/7813H01L2924/00H01L29/4236H01L21/28026
Inventor 富田茂树
Owner KK TOSHIBA