Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit-component carrying substrate

A technology of circuit components and substrates, which is applied in the direction of circuit substrate materials, printed circuit components, circuits, etc., and can solve problems such as cracks in the permanent protective layer

Inactive Publication Date: 2005-05-04
IBIDEN CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because it is easy to concentrate stress on these right angles, such as Figure 10 As shown, there is a new problem that cracks 64 are prone to occur on the permanent protective layer 63 near the right angle

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit-component carrying substrate
  • Circuit-component carrying substrate
  • Circuit-component carrying substrate

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment

[0125] image 3 It is a schematic diagram in which almost a quarter of the wiring board 51 for mounting electronic components is disconnected. The wiring board 51 has a glass epoxy substrate 54 as a core material. Also, instead of the glass epoxy substrate 54, a polyimide substrate or a bismaleimide triazine BT (bismaleimide triazine) resin substrate may also be used. Adhesive layers 55 (insulating layers) are formed on both surfaces of the substrate 54 using an additive-specific adhesive. The surface of the adhesive layer 55 is roughened so as to have a plurality of recesses for fixing. Here, as the binder, a cured photosensitive resin resistant to acids or oxidizing agents and cured heat-resistant resin particles soluble in acids or oxidizing agents are used. Because of this structure, the adhesive is suitable for forming fine images with high precision. The detailed composition of the adhesive is the same as in the above-mentioned examples.

[0126] A permanent solder ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The base plate includes following parts and structures: first connection terminal group composed of multiple connection terminals formed densely on surface of bottom board possessing through holes; second connection terminal group composed of multiple connection terminals formed on cirumferential on back surface of bottom board; first junction terminal group and second connection terminal group are connected by through holes; composite wiring layer in multiplayer including via holes formed on surface of bottom board; first connection terminal group through composite wiring layer in multiplayer and via holes is connected to second connection terminal group; composite wiring layer in multiplayer includes wiring diagrams with different line widths and diagram cones, whose width is changed continuously, in use for connecting different wiring diagrams; line width in zone with higher wiring density is smaller than line width in zone with lower wiring density.

Description

[0001] This application is a divisional application of the patent application No. 96198213.6, the filing date is September 12, 1996, and the title of the invention is a substrate for mounting circuit components. technical field [0002] The present invention relates to a printed circuit board for mounting circuit components in which connection terminal groups are formed on both front and back surfaces. technical background [0003] Conventionally, a wiring board 21 for mounting electronic components as shown in FIG. 8 is known as a printed circuit board on which a bare chip such as a flip chip or a package such as a BGA (Bump Grid Array) is mounted. [0004] Such a wiring board 21 has a base plate 22 having conductor layers formed mainly by a subtractive method (subtractive method) on both the front and back sides of the base plate 22 . In the central portion of the surface of the bottom plate 22, a region for mounting components is provided. In the same area, a plurality o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H05K1/03H05K3/46
Inventor 浅井元雄川村洋一郎森要二
Owner IBIDEN CO LTD