Circuit forming method of outer layer of circuit board
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市乐建感光材料科技有限公司
- Publication Date
- 2016-02-17
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a method for forming the outer circuit of a circuit board. Specifically, the invention relates to a method for using deep-cured UV ink instead of a dry film as a temporary protective film layer in the forming process of the outer circuit of a circuit board. Background technique
[0002] Circuit boards are regarded as an indispensable and important part in the rapidly developing electronics industry. The continuous improvement of circuits is to make continuous breakthroughs in the function and volume of electronic products. With the popularization of electronic products such as mobile phones and the ever-increasing functional requirements, the precision and complexity of circuit boards are also increasing day by day. All types of electronic products require circuit boards of varying complexity.
[0003] In the prior art, two processes are usually used to manufacture the outer layer circuit of the circuit board. The first proce...