LOCA jointing machine for CCD alignment

A laminating machine and laminating technology, applied to the surface coating liquid device, pre-treated surface, coating, etc., can solve the problems of reducing laminating efficiency and accuracy, wasting manpower and material resources, etc., and improve convenience , not easy to bubble, high efficiency effect

Inactive Publication Date: 2016-03-02
KUNSHAN SAMON AUTOMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the process of LOCA bonding, it needs to go through several processes of gluing, pre-curing, turning and bonding, and curing in sequence. After completing a part of the process on one

Method used

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  • LOCA jointing machine for CCD alignment
  • LOCA jointing machine for CCD alignment
  • LOCA jointing machine for CCD alignment

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Embodiment Construction

[0037] The present invention will be further described in detail below with reference to the accompanying drawings, so that those skilled in the art can implement it with reference to the text of the description.

[0038] It should be understood that terms such as "having", "including" and "including" used herein do not equate the presence or addition of one or more other elements or combinations thereof.

[0039] The CCD alignment LOCA laminating machine of the present invention is used to apply LOCA glue on the glued surface of the first substrate 1 and then attach it to the second substrate 2, such as Figure 1 to Figure 5 As shown, the CCD alignment LOCA laminating machine includes a slit coating mechanism 10, a glue supply mechanism 20, a pre-curing mechanism 30, a conveying mechanism 40, a flip laminating mechanism 50, a CCD alignment mechanism 60, a curing mechanism 70, and a curing mechanism. Platform 80.

[0040] The slit coating mechanism 10 is used to linearly coat the gl...

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PUM

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Abstract

The invention discloses an LOCA jointing machine for CCD alignment. The LOCA jointing machine comprises a slit coating mechanism, a glue supply mechanism, a pre-curing mechanism, a turnover jointing mechanism, a carrying mechanism, a CCD alignment mechanism and a curing mechanism. The slit coating mechanism is used for linearly coating the glued face of a first substrate with LOCA glue. The glue supply mechanism is used for supplying LOCA glue to the slit coating mechanism. The pre-curing mechanism is used for curing the LOCA glue sprayed on the glued face of the first substrate on the first substrate. The turnover jointing mechanism is used for turning over the first substrate with the pre-cured glued face and jointing the first substrate with the glued face downwards after turnover and a second substrate. The carrying mechanism is used for carrying the first coated substrate to the position below the pre-curing mechanism and carrying the first substrate with the pre-cured glued face to the turnover jointing mechanism. The CCD alignment mechanism is used for adjusting the first substrate with the pre-cured glued face to be aligned to the position to be jointed. The curing mechanism is used for curing the first substrate and the second substrate which are jointed. The gluing and jointing process are automatic, no manual operation is needed, and jointing accuracy and jointing efficiency are high.

Description

Technical field [0001] The present invention relates to a laminating device, more specifically, the present invention relates to a CCD-aligned LOCA laminating machine. Background technique [0002] With the development of society and technological progress, more and more electronic devices have LCD screens for display. In order to avoid the screen of electronic equipment from being scratched and damaged as much as possible, a protective glass is usually added to the surface of the LCD screen of the electronic equipment to protect the screen, and OCA (Optically Clear Adhesive) or LOCA is used between the protective glass and the screen. (LiquidOpticalClearAdhesive, liquid optical clear adhesive) bonding. Due to the problem of OCA glue itself in the production and processing yield and the difficulty of heavy work of OCA glue, the rapid development and wide application of LOCA bonding technology has been promoted. [0003] In the process of LOCA bonding, it needs to go through the p...

Claims

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Application Information

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IPC IPC(8): B05C5/00B05C11/10B05D3/00B05C13/02
CPCB05C5/00B05C11/10B05C13/02B05D3/00B05D3/002
Inventor 林少渊
Owner KUNSHAN SAMON AUTOMATION TECH
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