Method for manufacturing printed circuit board and printed circuit board

Abstract

The invention relates to a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board of the present invention comprises: a first coating layer formation step for forming a first coating layer on one surface of a substrate using conductive ink; a second coating layer formation step for forming a second coating layer on the other surface of the substrate using the conductive ink; a punching step for forming a through-hole by punching the first coating layer, the substrate, and the second coating layer; and a plating step for forming a plating layer by plating the first coating layer, the second coating layer, and an inner wall surface of the through-hole. Accordingly, the present invention provides the method for manufacturing the printed circuit board and the printed circuit board, which: can improve circuit pattern implementation accuracy and electrical properties through a conventional photography process when compared to the limitation of circuit pattern implementation and electric properties in a circuit fabrication process due to the existing printing method; can save base materials; can shorten a manufacturing process; and can improve productivity.

Description

technical field [0001] The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board, and more specifically relates to a printed circuit board capable of forming a circuit pattern with fine and excellent conductive properties, saving raw materials and shortening the process, etc. Manufacturing method and printed circuit board. Background technique [0002] Generally speaking, a printed circuit board (Printed Circuit Board) is an electronic component in the form of a substrate on which various electronic components are loaded and electrically connected. [0003] According to the hard and soft materials of the substrate, printed circuit boards are divided into two categories: rigid printed circuit boards (Rigid Printed Circuit Board) and flexible printed circuit boards (Flexible Circuit Board). Recently, hard and soft composite printed circuit boards have appeared. [0004] In the initial stage of the application of printed ci...

AI Technical Summary

Problems solved by technology

[0012] However, the method requires forming a printed circuit from a conductive paste by a printing method and filling the through hole with the conductive paste, but the printing method of forming the conductive part of the printed circuit from the conductive paste filling the through hole to form a protrusion is extremely limited. The conductive paste that is easy to form the conductive part of the printed circuit is difficult to fill the through hole and form a protrusion

In addition, the flexible printed circuit board manufactured in this way has the disadvantage that the connection part formed in the through hole will shrink or break under thermal or physical impact, and the possibility of disconnection is high, and there is also a need for further steps in the process. The disadvantage of adding a process that forms an additional closing plate part for preventing the leakage of the conductive paste filled in the through hole, so it has not been applied in the industry so far

In addition, since the adhesive force between the conductive paste layer and the base material is not sufficient, separation or detachment of the interface between the printed circuit formed by the conductive paste and the connecting conductor part forming the via hole protrusion increases, so it has not been practically used. change

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