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Gas tightness structure of sub-array module

An airtight, sub-array technology, applied in the direction of electrical components, connecting devices, circuits, etc., can solve the problem of large vertical size

Active Publication Date: 2016-03-09
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Brick sub-array is the most popular array structure. The component placement direction is perpendicular to the aperture plane of the phased array antenna. The radiation array element usually adopts dipole or tapered slot antenna. Its circuit and structure design follow the traditional subsystem concept , signal interconnection, testing and packaging technology inheritance is good, the disadvantage is that the vertical size is large

Method used

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  • Gas tightness structure of sub-array module
  • Gas tightness structure of sub-array module
  • Gas tightness structure of sub-array module

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Embodiment 1

[0026] Embodiment 1: as figure 1 , Figure 2a , Figure 2b As shown, an airtight structure of a subarray module is also provided in this embodiment, including a cavity 2 provided with N connection channels and a cover plate 1 provided with a through hole; the cavity 2 and the cover plate 1 fastening, the housing of the cavity 2 and the cover plate 1 is made of titanium alloy TC4; the N connecting channels are all provided with SSMP radio frequency connectors; the SSMP radio frequency connectors are soldered by gold tin The way is set in the connection channel; the through hole 21 of the cover plate 1 is provided with an SMP radio frequency connector 1; the SMP radio frequency connector 1 is set in the through hole of the cover plate 1 by gold solder In the hole; in this embodiment, a slot 41 and a boss 42 are respectively provided at the joint between the cavity body 2 and the cover plate 1 , and the slot 41 and the boss 42 are in conformity with each other.

[0027] The N ...

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Abstract

The invention relates to the field of microwave circuit vertical interconnection and especially relates to a gas tightness structure of a sub-array module. The gas tightness structure comprises a cavity body provided with N connection channels and a cover plate provided with a through hole. The cavity body is buckled with the cover plate. N is a natural number larger than 1. The buckled positions of the cavity body and the cover plate are respectively provided with a clamping groove and a boss. The clamping groove is matched with the boss in shape. According to the invention, the clamping groove and the boss are adopted for enhancing the gas tightness, and the gas tightness structure is further characterized in that welded parts of the cover plate and the cavity body are further arranged in a groove structure, the groove structure ensures that all welding materials are arranged in the groove structure after laser sealing, the vertical size of the sub-array module is not changed by welding, and the vertical integration is further prevented from being influenced.

Description

technical field [0001] The invention relates to the field of vertical interconnection of microwave circuits, in particular to an airtight structure of a sub-array module. Background technique [0002] There are two types of array structures for phased array antenna integration: vertical integration based on brick-type line sub-arrays; horizontal integration and vertical assembly based on tile-type surface sub-arrays. Brick-type sub-array is the most popular array structure. The component placement direction is perpendicular to the aperture plane of the phased array antenna. The radiation array element usually adopts dipole or tapered slot antenna. Its circuit and structure design follow the traditional subsystem concept , signal interconnection, testing and packaging technology inheritance is good, the disadvantage is the large vertical size. [0003] The tile-integrated sub-array module adopts a layered structure, integrates chips and circuits with the same function in mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/08
CPCH01P5/08
Inventor 赵伟管玉静吴凤鼎李超李灿
Owner 成都雷电微力科技股份有限公司