A ceramic ball fine-tuning device on a semiconductor hot plate
A technology of fine-tuning device and ceramic ball, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc. High uniformity effect
Active Publication Date: 2018-02-06
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
[0002] At present, in the semiconductor wafer production process, the requirements for the temperature uniformity of the hot plate surface are getting higher and higher. When the plate body after normal production and assembly is tested for the temperature uniformity of the hot plate surface, it is often due to some manufacturing errors and assembly errors. The limitation of the disk surface temperature uniformity index cannot be achieved
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Embodiment Construction
[0025] The present invention will be further described below in conjunction with the accompanying drawings.
[0026] Such as figure 1 As shown, the present invention includes a base plate 1, a two-dimensional mobile platform, a hot plate 4, ceramic balls 5, a ceramic ball extruding device 9, a lifting mechanism and a vacuum suction device 10, wherein the hot plate 4 is arranged on the base plate 1, and the heat plate 4 is arranged on the base plate 1. The outer circumference of the disc 4 is limited by a plurality of limit blocks 2 that are slidably connected to the bottom plate 1. The plurality of limit blocks 2 are used to limit the position of the hot disc 4 to be revised. Ceramic balls 5 accommodated in separate grooves. The two-dimensional mobile platform is arranged on the bottom plate 1 and located above the hot plate 4, the lifting mechanism is slidably connected to the two-dimensional mobile platform, and the lower end is detachably connected to the ceramic ball extr...
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The invention relates to a device for improving the performance index of a hot plate in semiconductor production equipment, in particular to a fine-tuning device for ceramic balls on a semiconductor hot plate. It includes a bottom plate, a two-dimensional mobile platform, a hot plate, ceramic balls, a ceramic ball extruding device, a lifting mechanism and a vacuum suction device. The ceramic balls inside, the two-dimensional mobile platform is set on the bottom plate and above the hot plate, the lifting mechanism is slidably connected to the two-dimensional mobile platform, and the lower end is detachably connected to the ceramic ball extrusion device or vacuum suction device; the ceramic ball extruding device squeezes each ceramic ball through the driving of the lifting mechanism, so that the height of each ceramic ball above the surface of the hot plate is consistent; the vacuum suction device moves downward through the driving of the lifting mechanism, The ceramic balls are aspirated from the hot plate. The invention can realize the precise adjustment of the height of the ceramic balls on the surface of the semiconductor hot plate, thereby improving the temperature uniformity of the hot plate and ensuring the uniformity of the adjusted height of the ceramic balls.
Description
technical field [0001] The invention relates to a device for improving the performance index of a hot plate in semiconductor production equipment, in particular to a fine-tuning device for ceramic balls on a semiconductor hot plate. Background technique [0002] At present, in the semiconductor wafer production process, the requirements for the temperature uniformity of the hot plate surface are getting higher and higher. When the plate body after normal production and assembly is tested for the temperature uniformity of the hot plate surface, it is often due to some manufacturing errors and assembly errors. The limitation of the disk surface temperature uniformity index cannot be achieved. If the unqualified disc body can be properly adjusted to meet the requirements, the cost of equipment can be greatly saved, and waste products caused by substandard performance can be prevented. At the same time, on the basis of the existing process requirements, it is also necessary to ...
Claims
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IPC IPC(8): H01L21/677H01L21/673
Inventor 尹硕
Owner SHENYANG KINGSEMI CO LTD