A glue dispensing method for protecting coils with caps

Abstract

The invention discloses a glue hooding device for protecting coils and a glue dispensing method thereof. The device comprises a glue dispensing machine, a glue dispensing mechanism connected with the glue dispensing machine, a feeding mechanism and a mold belt conveyor arranged on one side of the feeding mechanism. A drying device is arranged on the mold belt conveyor. The glue hooding device further comprises a discharging mechanism for discharging. The discharging mechanism comprises a first driving unit and a discharging ejecting pin. The glue dispensing mechanism, the feeding mechanism, the mold belt conveyor, the drying mechanism and the discharging mechanism are used, so that materials are supplied to the system automatically, synchronous continuous operation of mechanism feeding, UV instantaneous drying, glue dispensing, feeding, drying and demolding is achieved, automatic production line production can be achieved, maintenance is simple, and efficiency is high.

Description

technical field [0001] The invention relates to the field of coil production equipment for electronic products, in particular to a device for protecting a coil with a glue cap and a dispensing method thereof. Background technique [0002] With the development of electronic technology, electronic components are gradually developing towards miniaturization, light weight, high frequency, high current, low EMI and low manufacturing cost, and high reliability. Many products require glue protection for their winding coils. , to protect the coil from damage to meet the above requirements. Due to the needs of current electronic products, it is necessary to apply a layer of glue on the back side of the product with a cap to protect the coil from damage. The current general method is to use fly swatter to dispense glue, mechanism typesetting and feeding, and UV drying Dry oven drying, demoulding mechanism separate demoulding method, although this method can achieve the glue cap on th...

AI Technical Summary

Problems solved by technology

Due to the needs of current electronic products, it is necessary to apply a layer of glue on the back side of the product with a cap to protect the coil from damage. The current general method is to use fly swatter to dispense glue, mechanism typesetting and feeding, and UV drying Dry oven drying, demoulding mechanism separate demoulding method, although this method can achieve the glue cap on the coil, but the efficiency and pass rate are low, requiring a lot of manual work, and the scope of application is small (only caps can be used) Large products), small products are difficult to wear caps

[0003] Here, for the general use of fly swatters with caps on 5 sides on the product coil, although it is possible to protect the product coils with 5 sides of caps, the biggest defect of the fly swatter method is mainly low efficiency, low pass rate, and requires a lot of labor and labor. Auxiliary equipment and venues, and different products have higher requirements for related fixtures and skilled personnel, which are only applicable to large products

[0004] In addition, for the fly swatter method, for products of different specifications, different fly swatters and feeding and demoulding mechanisms need to be selected, which is difficult to meet quantitative, batch, and mixed production. At the same time, the technical requirements of operators are relatively high.

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