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Manufacturing method of flexible display device

A manufacturing method and flexible display technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as damage to the bonding area, and achieve the effect of improving yield and avoiding damage

Active Publication Date: 2018-02-06
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the bonding area is easily damaged when the flexible substrate is removed, the present disclosure provides a method for manufacturing a flexible display device

Method used

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  • Manufacturing method of flexible display device
  • Manufacturing method of flexible display device
  • Manufacturing method of flexible display device

Examples

Experimental program
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Embodiment Construction

[0023] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. In the drawings, the thickness of regions and layers are exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0024] The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, one skilled in the art will appreciate that the technic...

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PUM

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Abstract

A method for manufacturing a flexible display device, comprising: providing a carrier substrate (6), forming release layers (7a, 7b) on the carrier substrate (6), the release layer comprising a first release layer (7a) and a second release layer Two release layers (7b), the release force of the first release layer (7a) is weaker than the release force of the second release layer (7b); flexible substrates (2a are formed on the release layers (7a, 7b) ), the flexible substrate (2a) includes a bonding area (2b) and a non-bonding area, the bonding area (2b) corresponds to the first release layer (7a), and the non-bonding area corresponds to the second release layer layer corresponding (7b); on the bonding area (2b) of the flexible substrate (2a), combine the driving integrated circuit IC (3) and the flexible printed circuit board FPC (4); and take off the combined driving integrated circuit (3) and flexible A flexible substrate (2a) of a printed circuit board (4). The manufacturing method of the present disclosure prevents damage to the flexible substrate.

Description

technical field [0001] The present disclosure relates to a method for manufacturing a flexible display device, in particular to a method for manufacturing a flexible display device by using different release layers on a bonding area and a non-bonding area of ​​a flexible substrate. Background technique [0002] As a new generation of display devices, flexible display devices are widely used in mobile phones, personal digital assistants (PDAs), digital cameras, and vehicle displays because of their advantages such as thinness and lightness, high contrast, fast response, wide viewing angle, high brightness, and full color. , notebook computers, wall-mounted TVs, and military fields have very broad application prospects. [0003] like figure 1 As shown, the existing flexible display device 1 includes a display panel 2, the flexible substrate 2a of the display panel 2 has a bonding area 2b, and a driving integrated circuit (IC) 3 is electrically connected to the bonding area 2b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCY02E10/549Y02P70/50G02F1/133305G02F1/13454H10K59/129H10K77/111H10K71/80H10K2102/311
Inventor 陈淑媺施秉彝谢焕熏黄成沛卓家得
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD