Improved chip connection structure and manufacturing process thereof
A technology of connection structure and manufacturing process, applied in the field of electronics, can solve the problems of increasing the number of input and output pins, fine pitch cost and reliability, increasing solder balls, small package size, etc., to reduce the risk of solder bump offset , The effect of stable connection structure and improved circuit performance
Inactive Publication Date: 2016-03-30
SPREADTRUM COMM (SHANGHAI) CO LTD
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Problems solved by technology
[0002] BGA (BallGridArray, ball grid array) packaging is a surface mount packaging form widely used in the field of electronic packaging at present. Cost and reliability issues, and also has the characteristics of smaller package size, which adapts to the development trend of chip packaging. However, in the BGA ball planting process, refer to figure 1 and figure 2 , due to the use of spherical solder balls (2), and spherical solder balls (2) are easy to slide to cause solder ball offset, and, because the BGA substrate (1) inevitably has a certain degree of warpage, further increasing the The risk of solder ball offset has a great impact on the yield of the package structure
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[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0023] It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other if there is no conflict.
[0024] The present invention will be further described below with reference to the drawings and specific embodiments, but it is not a limitation of the present invention.
[0025] Reference image 3 , Figure 4 , An improved chip connection structure for the connection of the c...
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The invention relates to the field of electronic technology, particularly to a chip connection structure. An improved chip connection structure is used for connecting a chip to a printed circuit board. A plurality of bonding pads are distributed on the chip. A cube-shaped solder piece is disposed on each bonding pad. The chip is connected with the printed circuit board through the solder pieces. According to the invention, the cube-shaped solder pieces are adopted which cannot slide as compared with circular solder balls, and the offset risk of the solder pieces can be reduced; and meanwhile, the cube-shaped solder pieces have larger contact area with the printed circuit board after being melted so that the connection structure can be more stable, besides, the current path will be wider, and the improvement of the circuit performance is facilitated.
Description
Technical field [0001] The invention relates to the field of electronic technology, in particular to a chip connection structure. Background technique [0002] BGA (BallGrid Array, Ball Grid Array) package is a form of surface mount package widely used in the field of electronic packaging. Its emergence solves the problem of increasing the number of input and output pins and the fine pitch of the quad-lead flat package structure. Cost and reliability issues, while also having features such as smaller package size, adapted to the development trend of chip packaging, however, in the BGA ball planting process, refer to figure 1 with figure 2 Because the spherical solder ball (2) is used, the spherical solder ball (2) is easy to slide and cause the solder ball to shift. Moreover, because the BGA substrate (1) inevitably has a certain degree of warpage, it further increases The risk of solder ball shift has a great influence on the yield of the package structure. Summary of the inve...
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Login to View More IPC IPC(8): H01L23/488H01L21/60
Inventor 樊茂朱小荣
Owner SPREADTRUM COMM (SHANGHAI) CO LTD