Embedded metal line structure and manufacturing method
A technology of metal wiring and manufacturing method, which is applied in the direction of printed circuit manufacturing, electrical connection of printed components, printed circuit components, etc. Line and other problems, to achieve the effect of low chance of stripping
Inactive Publication Date: 2016-03-30
INTERFACE OPTOELECTRONICS SHENZHEN +1
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Problems solved by technology
[0003] In order to meet the high performance of the display module, its related components are usually required to have high light transmittance or light uniformity. If the metal traces protrude too much from the surface of the substrate, it is easy to cause optically transparent adhesives during lamination. Bubbles inside are not easy to discharge, and affect the high light transmittance or other optical properties of related components, which may reduce the overall yield of the product
[0004] However, if the thickness of the metal traces is blindly reduced, the resistance of the metal traces will be increased due to the reduction of the cross-sectional area of the metal traces, which will also affect the conduction of the metal traces, which may result in the loss or malfunction of related functions of the mobile electronic device. operate
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[0042] One aspect of the present invention is to provide a method for manufacturing an embedded metal wiring structure, so as to solve the problem that the metal wiring in the known mobile electronic device protrudes too much from the surface of the substrate, which may easily cause gaps in the optically transparent adhesive during lamination. Bubbles are not easy to discharge and other problems, and can meet the trend of thinning mobile electronic devices.
[0043] Please refer to figure 1 , which shows a schematic flowchart of a method for manufacturing an embedded metal wiring structure according to an embodiment of the present invention. The step 102 of the manufacturing method is to etch a wiring groove (for example, image 3 in the wiring groove 204f). In this embodiment, the material of the base material 102b may be a polymer, such as a base material made of PET (Polyethyleneterephthalate).
[0044] After step 102, step 104 may optionally be performed. Step 104 is t...
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Abstract
The invention reveals an embedded metal line structure and a manufacturing method. The structure comprises a base material and metal lines. The base material is provided with a plurality of line grooves which are located on the surface of the base material. A part of metal lines are embedded in the line grooves, and are partially bulged out of the surface of the base material, wherein the bulging height of the lines from the surface of the base material is less than 5mm, and the embedding depth of the lines into the line grooves is less than the half of the thickness of the base material. According to the invention, the structure is used for solving problems that the number of metal lines, which are bulged out of the surface of the base material, in a known electronic device is too large and bubbles in optical transmission glue are caused to be difficult to discharge. Moreover, the structure can meet the requirement of the thinning tendency of a mobile electronic device.
Description
technical field [0001] The present invention relates to an embedded metal wiring structure and a manufacturing method thereof, and in particular to an embedded metal wiring structure and a manufacturing method thereof applied to mobile electronic devices. Background technique [0002] In traditional metal wiring structure design of mobile electronic devices, printing is often used to pattern the desired metal wiring design on a substrate. When the structure of the metal traces is applied in the display module of the mobile electronic device, it is necessary to bond the side with the metal traces to the relevant components of the display module with an optically transparent adhesive. [0003] In order to meet the high performance of the display module, its related components are usually required to have high light transmittance or light uniformity. If the metal traces protrude too much from the surface of the substrate, it is easy to cause optically transparent adhesives duri...
Claims
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Login to View More IPC IPC(8): H05K1/11H05K3/10
CPCH05K1/11H05K3/107H05K2201/098
Inventor 张志鹏江英杰
Owner INTERFACE OPTOELECTRONICS SHENZHEN