Semiconductor film-formation device, substrate automatic positioning and clamping structure and clamping method
A film-forming equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as failure, uneven film formation, and no positioning and clamping of the substrate, and achieve simple structure and uniform film growth. , the effect of eliminating the differences between films
Active Publication Date: 2016-04-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0011] The object of the present invention is to solve the defect of no positioning and clamping of the substrate, and provide a semiconductor film forming equipment, an automatic positioning and clamping structure and a clamping method of the semiconductor substrate, which can automatically fix and position the substrate, avoiding the Substrate movement causes uneven film formation or even failure
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[0045] The invention will now be described in more detail with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The present invention may, but be embodied in different ways, but should not be limited to the embodiments described herein.
[0046]It should be noted that the automatic positioning and clamping structure and clamping method of the semiconductor substrate of the present invention can be used in the cavity of any semiconductor equipment that needs to fix the substrate on the base. Specifically, the automatic positioning and clamping structure and clamping method of the semiconductor substrate of the present invention are classified according to the function of the base, and can be applied to the cavity of a semiconductor film equipment having a lifting base or a base having a rotating function. It is also applicable to the cavity of a semiconductor film equipment with a fixed base; according to the number of wafers (i...
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Abstract
The invention discloses a semiconductor film-formation device, and a semiconductor substrate automatic positioning and clamping structure and a clamping method. The semiconductor film-formation device comprises M positioning and clamping structures; the M positioning and clamping structure and a base are annularly distributed around the upper surface of the base in a concentric manner, and are used for clamping the substrates in a technological process, wherein M is an integer greater than or equal to 3; the positioning and clamping structures comprise positioning holes penetrating through the base, and automatic positioning and clamping brackets, wherein the positioning and clamping brackets comprise fixed cylindrical supporting rods and transverse rods that are perpendicularly fixed with each other, and a supporting base arranged below the base; the transverse rods are positioned on the top parts of the supporting rods; one ends of the transverse rods face to the axis while the other ends of the transverse rods are far from the axis; positioning stages protruding out of the upper surfaces of the transverse rods and clamping acute angle clamping grooves that are formed in the inner sides of the positioning stages in a concave manner are arranged at the outer ends, far from the axis, of the transverse rods; the supporting rods penetrate through the positioning holes; the spherical bottoms of the supporting rods abut on the supporting base; and tangent planes are arranged on the cylindrical supporting rods on the same side as the positioning stages.
Description
technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a semiconductor film forming equipment, an automatic positioning and clamping structure and a clamping method for a semiconductor substrate. Background technique [0002] In recent years, semiconductor devices have developed rapidly, involving semiconductors, integrated circuits, solar panels, flat-panel displays, microelectronics, light-emitting diodes, etc. These devices are mainly composed of several layers of thin films with different material thicknesses formed on the substrate. Therefore, , as the core film forming equipment of semiconductor equipment, is an important factor determining the quality and yield of thin film growth of semiconductor devices. [0003] Generally, the semiconductor film forming equipment includes a base for placing the substrate in the reaction chamber. After the robot places the substrate and the reaction gas shower head concentric...
Claims
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Login to View More IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/6719H01L21/68721H01L21/6875
Inventor 王勇飞兰云峰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD