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Composite wiring board and mounting structure of the same

A technology for wiring substrates and structures, applied in circuit devices, circuit thermal devices, electric solid devices, etc., can solve the problem of low heat diffusion ability, and achieve the effects of increased capacity, high capacity, and high electromagnetic shielding effect.

Inactive Publication Date: 2016-04-06
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the ability to dissipate the heat generated when the first electronic component E1 and the second electronic component E2 are in operation to the outside is low

Method used

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  • Composite wiring board and mounting structure of the same
  • Composite wiring board and mounting structure of the same
  • Composite wiring board and mounting structure of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] A composite wiring board according to one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a schematic cross-sectional view showing a composite wiring board 30 according to one embodiment, and the composite wiring board 30 is composed of a first wiring board 10 and a second wiring board 20 .

[0024] Such as figure 1 As shown, the composite wiring board 30 is formed by joining the flat second wiring board 20 to the frame-like first wiring board 10 . An opening 10 a for accommodating electronic components E1 such as semiconductor elements is formed in a central portion of the first wiring board 10 . The first electronic component E1 housed in the opening 10 a is mounted on the lower surface of the second wiring board 20 . Second electronic components E2 such as semiconductor elements are mounted on the upper surface of the second wiring board 20 .

[0025] (first wiring board)

[0026] The first wiring board 10 in...

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PUM

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Abstract

A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder.

Description

technical field [0001] The present invention relates to a composite wiring board formed by bonding a planar wiring board to a frame-shaped wiring board with solder, and a mounting structure thereof. Background technique [0002] Conventionally, a composite wiring substrate 70 is known such as Figure 19 As shown in the schematic cross-sectional view, the composite wiring board 70 is formed by joining a flat second wiring board 60 to a frame-like first wiring board 50 with solder (JP-A-2013-51384). An opening 50 a for accommodating first electronic components E1 such as semiconductor elements is formed in a central portion of the first wiring board 50 . The first electronic component E1 housed in the opening 50 a is mounted on the lower surface of the second wiring board 60 . Second electronic components E2 such as semiconductor elements are mounted on the upper surface of the second wiring board 60 . [0003] The first wiring board 50 includes an insulating plate 51 , a wi...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0203H05K1/0224H05K1/144H05K1/183H05K3/426H05K3/4697H05K2201/041H05K2201/0959H05K2201/09981H05K2201/10545H05K2203/025H01L23/13H01L23/49822H01L23/49827H01L23/49833H01L25/0657H01L23/552H01L24/16H01L2224/131H01L2224/16227H01L2225/06517H01L2924/3025H01L2225/06572H05K1/0218H01L2924/014H01L2924/00014H05K1/181
Inventor 樱井敬三
Owner KYOCERA CORP