High-integration T component channel integration method for phased-array antenna

Abstract

The invention provides a high-integration T component channel integration method for a phased-array antenna, and aims at providing a high-integration and high-efficiency design method for an eight-channel T component, which is simple to achieve and can meet a Ka band. According to the technical scheme, multiple channels of a Ka-band T component and multiple phase-shifting and pre-amplifying device functions of each channel are integrated into a silicon-based CMOS process integration chip; in the T component of the phased-array transmitting antenna, multiple paths of Ka-band radio-frequency signals from a beam forming network are simultaneously transmitted into a multi-channel CMOS process integration chip and the silicon-based CMOS process integration chip; phase shifting, amplitude attenuation and power pre-amplification of the multiple paths of signals are achieved in parallel through a microcircuit; the CMOS process integration chip outputs multiple paths of phase-shifted and amplified radio-frequency signals to a gallium arsenide GaAs power amplifier PA chip; and the amplified Ka-band radio-frequency signals are output to multiple antenna array elements of an antenna array plane.

Description

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AI Technical Summary

Benefits of technology

This patented technology improves on existing designs for achieving higher levels of performance (higher data transmission speed) while reducing energy usage compared to previous technologies like LC waveguides or hybrid circuits. It also allows more complex signal processing techniques such as digital predistortion and analog beamformers can now be used instead of expensive electronic equipment. Overall, this innovative solution helps improve communication systems' efficiency by enabling efficient use of limited resources within specific areas without sacrificing their functionality.

Problems solved by technology

Technics: Current designs for Ku-Band Phase Array Transmitted Antenna Units (KTA' s) use multiple separate parts such as transmitters, receivers, radiosets, and circuits related thereto. These parts require different types of materials like ceramic substrates, metal traces, dielectric layers, etc., resulting in increased manufacture costs due to material usage requirements and reduced overall device operational efficacy caused by heat dissipated during certain periods when they operate at frequencies below 1 GHz. To address these issues, there has been proposed various integrated methods involving combining several smaller subcomponents together into one larger unit while minimizing interference among themselves.

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