Rigid-flex board and mobile terminal

A soft-rigid combination board and hard layer technology, applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve the problems of improper connection, inability to connect, separation of circuit layer and hard layer, etc. The effect of ensuring the conduction connection and enhancing the connection strength

Active Publication Date: 2016-04-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the circuit layer is directly stacked on the hard layer, when the circuit layer is pulled during the connection process with the e...

Method used

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  • Rigid-flex board and mobile terminal
  • Rigid-flex board and mobile terminal
  • Rigid-flex board and mobile terminal

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0021] Please also refer to Figure 1 to Figure 2 , a rigid-flex board 100 provided by an embodiment of the present invention, the rigid-flex board 100 includes a flexible substrate layer 10 , a copper foil layer 20 , a hard layer 30 , a solder resist ink layer 40 and a circuit layer 50 . The copper foil layer 20 is stacked on the flexible substrate layer 10 , and the hard layer 30 is disposed on a side of the copper foil layer 20 away from the flexible substrate layer 10 . The solder resist ink layer 40 is arranged on the hard layer 30, and an empty window 41 is opened on the solder resist ink layer 40 to expose part of the hard layer 30. The empty window 41 covers the solder resist The ink layer 40 is divided into two parts opposite to each other. The two parts are respecti...

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PUM

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Abstract

The invention provides a rigid-flex board and a mobile terminal. The rigid-flex board comprises a flexible base material layer, a copper foil layer, a hard layer, a solder-resistant ink layer and a circuit layer, wherein the copper foil layer is laminated on the flexible base material layer; the hard layer is arranged on one side, away from the flexible base material layer, of the copper foil layer; the solder-resistant ink layer is arranged on the hard layer, a hollow window is formed in the solder-resistant ink layer for exposing a part of the hard layer, and the hollow window divides the solder-resistant ink layer into two parts facing each other, clamping grooves are formed in the two parts, and the two clamping grooves are communicated with the hollow window, the circuit layer is arranged in the hollow window and laminated on the hard layer, and both ends of the circuit layer are clamped in the two clamping grooves separately. According to the rigid-flex board and the mobile terminal provided by the invention, the two clamping grooves of the solder-resistant ink layer are used for clamping both ends of the circuit layer, so that the solder-resistant ink layer has a compression acting force on the circuit layer, the circuit layer can be prevented from being separated from the hard layer due to pulling situation when the circuit layer is connected with an electronic element, the connection strength between the circuit layer and the hard layer is enhanced, and the conduction connection of the circuit layer and the electronic element is ensured.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a rigid-flex board and a terminal. Background technique [0002] At present, the hard part of the rigid-flex board is usually a hard layer with a window exposed on the solder resist ink layer, and then the circuit layer is arranged in the window. When the hard board is connected with the electronic components, the electronic components are connected with the circuit layer through the window. However, since the circuit layer is directly stacked on the hard layer, when the circuit layer is pulled during the connection process with the electronic components, it is easy to cause the circuit layer to separate from the hard layer, resulting in improper connection or failure to connect. Contents of the invention [0003] In view of this, the present invention provides a rigid-flex board and a mobile terminal that enhance the connection strength between the circuit layer and th...

Claims

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Application Information

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IPC IPC(8): H05K1/14
CPCH05K1/144H05K2201/04
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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