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A dual-purpose flexible processing device for grinding and polishing for substrate processing

A technology for flexible processing and grinding tools, applied in grinding tools, grinding drive devices, grinding/polishing equipment, etc., can solve problems such as easy cracking, pollution, easy warping and deformation, increase the processing contact area, avoid chemical Waste liquid, the effect of reducing residual stress

Inactive Publication Date: 2017-07-21
CHINA JILIANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the disadvantages of the existing hard grinding wheel grinding and polishing methods, such as easy warping, deformation, and cracking, and the environmental pollution caused by mechanochemical polishing, and to achieve high-efficiency, low-loss, and clean crystal substrates Ultra-precision processing of wafers, the invention provides a flexible processing device for grinding and polishing for substrate processing. The pneumatic grinding tool and the pneumatic polishing tool use a soft rubber ring with good elasticity as a flexible support, and adjust the rubber ring through control. The inner inflation pressure of the ring changes the hardness of the processing tool, which can reduce the surface residual stress after substrate processing, so as to improve the yield of substrate grinding and polishing processing

Method used

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  • A dual-purpose flexible processing device for grinding and polishing for substrate processing
  • A dual-purpose flexible processing device for grinding and polishing for substrate processing
  • A dual-purpose flexible processing device for grinding and polishing for substrate processing

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] A dual-purpose flexible processing device for grinding and polishing for substrate processing, comprising a processing system host 1, a tooling suction cup tool 2, a pneumatic grinding tool 3, and a pneumatic polishing tool 4, characterized in that the processing system host 1, It includes a frame body 101, a bearing seat 102, a motor 108, a ball screw 103, a sliding table 104, a drive link 105, a turntable 106, a control box 107, a synchronous pulley 109, a synchronous belt 110 and a feed drive motor 111, wherein , the core component of the mainframe 1 of the processing system is the frame body 101, the top of the frame body 101 is installed with a feed drive motor 111, and the output shaft of the feed drive motor 111 is installed with a synchronous pulley 109 and Timing belt 110, four bearing seats 102 are installed on both sides of the frame body 101, ball sc...

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Abstract

The invention provides a dual-purpose flexible processing device used for grinding and polishing of substrate processing. The dual-purpose flexible processing device comprises a processing system main engine, a tool sucking disc tool, a pneumatic grinding tool and a pneumatic polishing tool, wherein both the pneumatic grinding tool and the pneumatic polishing tool adopt soft rubber rings with good elastic performances as flexible support to control and regulate gas charging pressure inside the rubber rings to change hardness of the processing tools, so that the surface residual stress of the processed substrate surface can be reduced, the warping problem which normally appears in substrate processing is avoided, the yield of substrate grinding and polishing is increased, and pollution to the environment is avoided. Meanwhile, the grinding process and the polishing process are integrated, so that the processing efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of precision processing, and particularly relates to the ultra-precision grinding and polishing automatic processing of functional crystal substrates such as single crystal silicon wafers. Background technique [0002] The functional crystal substrate made of single crystal silicon crystal is used as the main substrate material of the integrated circuit, and its surface processing technology represents the most advanced manufacturing technology in ultra-precision processing. At present, the substrate obtained by slicing needs to be subjected to ultra-precision grinding and chemical mechanical polishing methods to achieve the required precision. The existing ultra-precision grinding methods all use a hard grinding wheel grinding method, and after polishing, a corrosion removal step is required to obtain an ultra-smooth and low-damage substrate surface. Due to the hard and brittle characteristics of the subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/00B24B47/12B24B37/11B24B41/047B24B57/02
CPCB24B27/0069B24B27/0076B24B37/11B24B41/047B24B47/12B24B57/02
Inventor 厉志安李琛
Owner CHINA JILIANG UNIV
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