Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate, manufacturing method thereof and display device

A technology of an array substrate and a manufacturing method, which is applied in the display field, can solve the problems of easy occurrence of depression at the via hole, uneven diffusion of the alignment film, poor display panel, etc., so as to improve the display effect, achieve flattening, and solve the effect of poor Mura.

Active Publication Date: 2016-05-04
BOE TECH GRP CO LTD +1
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing array substrate, in order to conduct the patterns located in different film layers, it is necessary to make via holes. The via holes include the pixel electrode conductive via holes connecting the pixel electrodes and the drain electrodes of the thin film transistors, and also include connecting the common electrodes with the common electrodes. The common electrode connected by the electrode connection wires is generally narrow and deep, so it is easy to have a depression at the via hole, so that when the alignment film is coated on the array substrate, the alignment film is easy to be easily damaged at the via hole. Uneven diffusion occurs, resulting in mura (spot) defects in the final display panel

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, manufacturing method thereof and display device
  • Array substrate, manufacturing method thereof and display device
  • Array substrate, manufacturing method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Such as figure 1 and figure 2 As shown, in the existing array substrate, in order to conduct the patterns located in different film layers, it is necessary to make via holes, the via holes include the pixel electrode via hole 7 connecting the pixel electrode 6 and the drain of the thin film transistor, and also include The common electrode via hole 9 connecting the common electrode 8 and the common electrode connection line is generally 7 μm*7 μm in size. These via holes are generally narrow and deep, so that depressions are prone to occur at the via holes, resulting in When the alignment film is coated on the upper surface, the alignment film is prone to uneven diffusion at the via holes, resulting in mura defects in the final display panel.

[0056] In order to solve the above problems, this embodiment provides an array substrate, including a first conductive pattern, an insulating layer covering the first conductive pattern, and a second conductive pattern on the i...

Embodiment 2

[0063] This embodiment provides a method for fabricating an array substrate, including forming a first conductive pattern, an insulating layer covering the first conductive pattern, and a second conductive pattern on the insulating layer, and the insulating layer includes Connecting the via holes of the first conductive pattern and the second conductive pattern, the method includes:

[0064]Before forming the second conductive pattern, forming a conductive column connected to the first conductive pattern in the via hole;

[0065] A second conductive pattern connected to the conductive column is formed.

[0066] In this embodiment, before forming the second conductive pattern on the insulating layer, a conductive column is made at the via hole in the insulating layer, and the conductive column is connected with the first conductive pattern under the insulating layer, so that the The first conductive pattern and the second conductive pattern are connected. Since the conductive ...

Embodiment 3

[0095] This embodiment provides a method for fabricating an array substrate, such as Figure 4 As shown, this embodiment includes the following steps:

[0096] Step 31: Provide a base substrate 1, form conductive pillars 10 and gate lines, common electrode lines, and gates formed by the gate metal layer 2 on the base substrate 1, and connect the conductive pillars 10 to the common electrode lines;

[0097] Wherein, the base substrate 1 may be a glass substrate or a quartz substrate. The conductive column 10 can be made of the same material as the gate metal layer, so that the conductive column 10 can be formed simultaneously with the grid line, common electrode line, and gate through a patterning process; the conductive column 10 can also be made of an organic conductive polymer.

[0098] Alternatively, the main body of the conductive pillar 10 can be a resin pillar, and the resin pillar is wrapped with a conductive material. At this time, the conductive pillar 10, the gate l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an array substrate, a manufacturing method thereof and a display device, and belongs to the technical field of displaying. The array substrate comprises a first conductive pattern, an insulating layer with which the first conductive pattern is covered and a second conductive pattern located on the insulating layer. The insulating layer comprises a via hole for connecting the first conductive pattern and the second conductive pattern, and a conducting post connected with the first conductive pattern and the second conductive pattern is formed in the through hole. By means of the array substrate in the technical scheme, the poor Mura caused by uneven diffusion of an alignment film at the via hole can be overcome, and the display effect of the display device can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] In the existing array substrate, in order to conduct the patterns located in different film layers, it is necessary to make via holes. The via holes include the pixel electrode conductive via holes connecting the pixel electrodes and the drain electrodes of the thin film transistors, and also include connecting the common electrodes with the common electrodes. The common electrode connected by the electrode connection wires is generally narrow and deep, so it is easy to have a depression at the via hole, so that when the alignment film is coated on the array substrate, the alignment film is easy to be easily damaged at the via hole. Uneven diffusion occurs, resulting in mura (spot) defects in the final display panel. Contents of the invention [0003] The technical ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/768H01L27/12
CPCH01L21/76877H01L27/124H01L27/1259G02F1/136227G02F1/1368H01L27/12G02F1/1337G02F1/134309G02F1/13439G02F2201/121G02F2201/123H01L27/1262
Inventor 任锦宇王丹徐长健马国靖周波
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com