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Automatic tool and method for assisting board taking from wave soldering carrier

An automated tool, wave soldering technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., to improve work efficiency, reduce work complexity and strength, and avoid damaged parts

Inactive Publication Date: 2016-05-04
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is: in view of the above problems, the present invention proposes an automatic tool and method for assisting board removal from the wave soldering carrier, which can easily remove the board from the wave soldering carrier and avoid As a result, the appearance of secondary pollution and potential reliability problems, improve product quality and improve personnel operating efficiency

Method used

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  • Automatic tool and method for assisting board taking from wave soldering carrier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, an automatic tool for assisting board removal from a wave soldering carrier, the tool includes a box body 1, a number of round holes are arranged on the upper surface of the box body 1, and support pins 3 are arranged in the round holes, and the side of the box body 1 A moving lifting rod 4 is provided, and the lifting of the supporting pins 3 can be controlled by moving the lifting rod 4; the distribution position of the supporting pins 3 corresponds to the position without parts on the bottom surface of the PCBA in the wave soldering carrier 2.

Embodiment 2

[0025] On the basis of Embodiment 1, a pallet is provided inside the box body 1 in this embodiment close to the upper surface, the moving lifting rod 4 controls the pallet to move up and down through the linkage device, and the support pin 3 is inserted into the upper surface of the box body. In the round hole, the end is placed on the supporting plate, and can rise and fall as the supporting plate moves up and down. The distribution position of the support pins can be adjusted according to the position of the wave soldering carrier and PCBA components to enhance the adaptability.

Embodiment 3

[0027] On the basis of Embodiment 1 or 2, a fixing device is provided on the upper surface of the box body 1 near the edge in this embodiment, and when the wave soldering carrier is placed on the box body, the carrier can be fixed on the box body.

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Abstract

The invention discloses an automatic tool and a method for assisting board taking from a wave soldering carrier. The tool comprises a box body, wherein a plurality of round holes are formed in the upper surface of the box body; a support needle is arranged in each round hole; a movable lifting rod is arranged on the side surface of the box body; lifting of the support needles can be controlled through the movable lifting rod; and the distribution positions of the support needles correspond to the position, free of a part, on the bottom surface of a PCBA in the wave soldering carrier. The PCBA can be vertically separated, so that the damage to the board caused by uneven stress is effectively avoided; a glove is prevented from being in vertical contact with the surface of the part; the part can be prevented from being smudged when in contact with the glove; the operation complexity and strength of the personnel are reduced; and the operation efficiency is improved.

Description

technical field [0001] The present invention relates to the technical field of server PCBA manufacturing, in particular to an automatic tool and method for assisting in taking out boards from wave soldering carriers, mainly used to solve the problem that it is difficult to take out PCBA boards in wave soldering carriers and the resulting problems Appearance pollution and reliability problems, to improve product quality, reduce product repair costs and improve product competitiveness. Background technique [0002] The era of wave soldering has not become the past, but is developing with the integration of SMT technology and the improvement of quality requirements. [0003] Wave soldering is to use the molten liquid solder to form a solder wave of a specific shape on the liquid surface of the solder tank with the help of the pump, and place the PCB with the inserted parts on the conveyor chain through a specific angle and a certain immersion depth. The process of passing a so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/34H05K2203/044
Inventor 葛汝田
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD