Magnetron sputtering device and magnetron sputtering method

Abstract

The invention provides a magnetron sputtering device and a magnetron sputtering method. A magnet set in the magnetron sputtering device is set to have a plurality of magnet units which are arranged at intervals and distributed in a matrix way, and the S poles and the N poles of the plurality of magnet units in each line and each row of the magnet set are alternatively distributed to form a uniform magnetic filed with matrix periodicity, so that the wear rates of all regions of a target are uniform, target utilization rate is greatly improved, and the film thickness and stress uniformity of film formation are improved; and meanwhile, during magnetron sputtering processing, a motor can drive the whole magnet set to reciprocate in front-back and left-right directions in a horizontal direction, and a plurality of motors can control the plurality of magnet units to respectively move up and down, so that the consumption of the target is more uniform, and the service life of the target is prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a magnetron sputtering device and a magnetron sputtering method. Background technique [0002] At present, the LCD panel industry mostly uses the magnetron sputtering method for metal film formation. Magnetron sputtering has the advantages of high speed, low temperature, and low damage. Magnetron sputtering introduces a magnetic field on the surface of the target cathode, and uses the magnetic field to confine charged particles to increase the plasma density to increase the sputtering rate. [0003] The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to the substrate under the action of electric field E, so that they are ionized to produce positive argon ions Ar + and new electronic e - ; new electronic e - Fly to the substrate, argon positive ions Ar + Under the action of the electric field E, it accelerates to f...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a magnetron sputtering device, which can solve the problem of low target utilization rate in the magnetron sputtering process, and can make the consumption rate of each area of ​​the target more uniform, so that the target utilization rate is greatly improved , improve film thickness and stress uniformity

[0007] The purpose of the present invention is also to provide a magnetron sputtering method, which can solve the problem of low target utilization rate in the magnetron sputtering process, and can make the consumption rate of each area of ​​the target more uniform, so that the target utilization rate is greatly improved. Improve and improve the film thickness and stress uniformity of film formation

Images