A kind of secondary etching double-sided circuit board and its processing technology

A double-sided circuit board and secondary etching technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of uncontrolled product quality, long cycle period, and failure to meet customer requirements, etc., to simplify production Process and operation difficulty, reduce PCB production cost, shorten the effect of production process cycle

Active Publication Date: 2018-03-09
苏州市三生电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements.

Method used

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  • A kind of secondary etching double-sided circuit board and its processing technology
  • A kind of secondary etching double-sided circuit board and its processing technology
  • A kind of secondary etching double-sided circuit board and its processing technology

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Embodiment Construction

[0026] Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail:

[0027] refer to image 3 As shown, a double-sided circuit board for secondary etching includes: GTL circuit layer 1, insulating PP layer 2 and GBL circuit layer, and the GBL circuit layer is composed of a GBL inner circuit layer 3 and a GBL outer circuit layer 4. The GTL line layer 1 and the GBL inner line layer 3 are connected to the insulating PP layer 2 at the same time, the GBL outer line layer 4 is covered on the GBL inner line layer 3, and the size of the GBL outer line layer 4 is larger than that of the GBL inner line layer 3 size.

[0028] The size of the GBL outer circuit layer 4 is 0.05 mm larger than the size of the GBL inner circuit layer 3 .

[0029] The secondary etched double-sided circuit board is formed through a secondary circuit processing process.

[0030] Such as figure 1 As shown, the first circuit processing technology includes...

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Abstract

The invention discloses a secondary etching double-sided circuit board and its processing technology. The secondary etching double-sided circuit board comprises: a GTL circuit layer, an insulating PP layer and a GBL circuit layer, and the GBL circuit layer consists of a GBL inner circuit layer Layer and GBL outer circuit layer, the GTL circuit layer and the GBL inner circuit layer are connected to the insulating PP layer at the same time, the GBL outer circuit layer is covered on the GBL inner circuit layer, and the double-sided circuit board is etched twice Secondary circuit processing process formation, including the first circuit production - - - line development - - - line inspection - - - acid etching - - - surface treatment, the second circuit production - - - line development - line inspection - - etching ‑‑‑Electric open and short circuit—after process. The invention only needs secondary production, requires less investment, simplifies the production process and operation difficulty, improves the production efficiency, reduces the production cost, reduces the defective rate of products, and shortens the production cycle of products.

Description

technical field [0001] The invention relates to a circuit board, in particular to a secondary etching double-sided circuit board and its processing technology. Background technique [0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements. In order to solve the above problems, a new type of superimposed circuit board circuit production update technology has been developed to improve the reliability of PCB boards, reduce PCB production costs and shorten the production process cyc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K3/00
Inventor 孙祥根
Owner 苏州市三生电子有限公司
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