A kind of secondary etching double-sided circuit board and its processing technology

Abstract

The invention discloses a secondary etching double-sided circuit board and its processing technology. The secondary etching double-sided circuit board of the present invention comprises: a GTL circuit layer, an insulating PP layer and a GBL stepped surface circuit layer, and the GBL stepped surface circuit layer The layer is composed of GBL inner line layer and GBL outer line layer. The GTL line layer and GBL inner line layer are connected to the insulating PP layer at the same time. The GBL outer line layer is covered on the GBL inner line layer. A secondary etching double The surface circuit board processing process follows the following steps: the first circuit production - - - line development cam compensation - - - line inspection - - - etching - - - the second circuit production - - - line development cam compensation - - - circuit Check--etching--electrical open and short-circuit--after process. The invention only needs secondary production, requires less investment, simplifies the production process and operation difficulty, improves the production efficiency, reduces the production cost, reduces the defective rate of products, and shortens the production cycle of products.

Description

technical field [0001] The invention relates to a circuit board and its processing technology, in particular to a secondary etching double-sided circuit board and its processing technology. Background technique [0002] In the current circuit board processing technology, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is high. Without control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements; the operation can be completed after the second research, and the product quality can also be improved. get regulated. In order to solve the above problems, a new type of superimposed circuit board circuit production update technolo...

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Problems solved by technology

[0002] In the current circuit board processing technology, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is high. Without control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements; the operation can be completed after the second research, and the product quality can also be improved. be regulated

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