Two-pack epoxy resin composition for fiber-reinforced composite material, and the fiber-reinforced composite material

Abstract

By employing a two-pack epoxy resin composition for a fiber-reinforced composite material, which composition includes the following components [A] to [D], and in which the mass compounding ratio of component [A] and component [B] is 5:95-50:50, there is provided a fiber-reinforced composite material which has exceptional workability during resin preparation, exceptional stability of viscosity of the resin composition at low temperatures, and exceptional impregnation properties such that low viscosity is maintained during injection into reinforcing fibers, and which cures with a short time during molding, and has high dimensional stability and exceptional heat resistance. The component [A] is an epoxy resin having an epoxy equivalent of 250 or less, and a hydroxyl equivalent of 500 or less, the component [B] is an epoxy resin different from the component [A], the component [C] is an acid anhydride, and the component [D] is an organic phosphorus compound or imidazole derivative.

Description

technical field [0001] The present invention relates to a two-component epoxy resin composition used in a fiber-reinforced composite material, and a fiber-reinforced composite material using the two-component epoxy resin composition. Background technique [0002] Fiber-reinforced composite materials consisting of reinforcing fibers and matrix resins allow the design of materials that take advantage of the strengths of reinforcing fibers and matrix resins. Therefore, applications are expanding in the aerospace field, sports fields, and general industrial fields. [0003] As the reinforcing fibers, glass fibers, aramid fibers, carbon fibers, boron fibers, and the like are used. As the matrix resin, either a thermosetting resin or a thermoplastic resin is used, and a thermosetting resin that is easily impregnated into the reinforcing fibers is often used. As the thermosetting resin, epoxy resin, unsaturated polyester resin, vinyl ester resin, phenol resin, bismaleimide resin, ...

AI Technical Summary

Problems solved by technology

However, in this technique, the high-speed curability may not be sufficient, and the rigidity of the resin at the time of mold release may be insufficient, resulting in a problem of reduced dimensional accuracy.

[0010] In addition, Patent Document 3 discloses that by using an epoxy resin obtained by hydrogenating an aromatic epoxy resin as a main ingredient, an acid anhydride is used as a curing agent, and an aliphatic polyhydric alcohol having 16 to 60 carbon atoms is combined therein, thereby It is a technology to improve the toughness of the cured resin and the generation of cracks caused by cooling and heating cycles, and to produce an epoxy resin composition for semiconductor sealing materials with excellent weather resistance. However, this technology does not have sufficient high-speed curing properties and is not suitable for Fiber Reinforced Composites Applications

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