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Linear high packing density for led arrays

一种电性、电性连接的技术，应用在固态光源领域，能够解决LED间隔太紧密等问题

Active Publication Date: 2020-10-20
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This limits LEDs to configurations for high voltage operation, as the LEDs cannot be spaced too closely together

Method used

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  • Linear high packing density for led arrays
  • Linear high packing density for led arrays
  • Linear high packing density for led arrays

Examples

Experimental program
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Embodiment Construction

[0018] Embodiments of the present disclosure provide higher packing density solid state light sources. The solid state light sources of the present invention may advantageously provide improved heating of substrates and other components disposed in processing chambers. In the following description, the term substrate is intended to broadly encompass any object that is processed in a chamber, such as a thermal processing chamber, a degassing chamber, a load lock chamber, and the like. The term substrate may include, for example, semiconductor wafers, flat panel displays, glass plates or discs, plastic workpieces, and the like. In the following description, solid state point light sources include light emitting diodes (LEDs) and lasers. Furthermore, while described below in terms of LEDs or LED arrays, lasers and laser arrays or other solid state point sources of light may alternatively be used in the embodiments described herein.

[0019] Exemplary chamber hardware

[0020...

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Abstract

Provided herein are apparatuses for providing energy to a processing chamber. In one embodiment, the apparatus includes a support substrate, a first plurality of solid state light sources disposed on a first surface of the support substrate, and a second plurality of solid state light sources disposed on a top surface of the support substrate, wherein the first plurality of A solid state light source is aligned with and electrically isolated from the second plurality of solid state light sources, and the first plurality of solid state light sources is in physical contact with the second plurality of solid state light sources.

Description

technical field [0001] Embodiments of the present disclosure relate generally to semiconductor processing systems, and more particularly, to solid state light sources for use in semiconductor processing systems. Background technique [0002] Several applications involving thermal processing of substrates, such as semiconductor wafers and other materials, involve the processing steps of rapidly heating and cooling the substrate. Examples of such processes include rapid thermal processing (RTP), physical vapor deposition (PVD) processes, and the like, which are used in many semiconductor manufacturing processes. [0003] During semiconductor fabrication processing, thermal energy from lamps radiates into a processing chamber and radiates onto semiconductor substrates in the processing chamber. In this way, the substrate is heated to the desired processing temperature. In general, the use of conventional lamps (tungsten-halogen, mercury vapor, arc discharge) or electric heati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/324H01L21/02
CPCH01L21/67115F21K9/20H01L21/324H01L21/67098H01L27/156F26B3/30
Inventor 约瑟夫·R·约翰逊约瑟夫·M·拉内什
Owner APPLIED MATERIALS INC