Pulsation heat pipe radiating apparatus for cooling chips
A technology of pulsating heat pipes and cooling devices, applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of chip temperature rise, large space occupation, and inability to export chip heat, and achieve high heat dissipation density, high-speed and stable operation, The effect of high heat dissipation efficiency
Inactive Publication Date: 2016-06-01
XI AN JIAOTONG UNIV
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Problems solved by technology
Among them, due to the low thermal conductivity of the heat conduction medium of the air-cooled heat dissipation technology, when the chip heats up seriously, the cooling efficiency of the cooling device can easily reach its working limit, and the heat from the chip cannot be effectively exported, resulting in a rapid rise in the chip temperature. Deterioration of the working environment
Water-cooling heat dissipation technology must be equipped with auxiliary power devices, resulting in a large footprint
In addition, due to the complicated manufacturing process of the internal liquid-absorbing core of the traditional heat pipe cooling technology, its manufacturing cost is relatively high
Method used
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[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings.
[0017] like figure 1 , figure 2 and image 3 As shown, a pulsating heat pipe cooling device for chip cooling includes a chip module 1 and a chip cooling base 2 installed on its upper part, the chip cooling base 2 is pressed together with a closed spiral pulsating heat pipe 3, and the closed type The evaporating section 8 of the spiral pulsating heat pipe 3 is embedded in the chip cooling base 2, so that the bottom surface 7 of the evaporating section 8 of the closed spiral pulsating heat pipe 3 is fully in contact with the chip module 1, and the cooling fan bracket is fixed on the side of the chip cooling base 2 4. A cooling fan 5 is fixed on the cooling fan bracket 4, and the cooling fan 5 is located on the upper part of the condensation section 9 of the closed spiral pulsating heat pipe 3.
[0018] The thermal conductive silica gel material 6 is filled ...
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A pulsation heat pipe radiating apparatus for cooling chips is disclosed. The pulsation heat pipe radiating apparatus comprises a chip module and a chip cooling base mounted at the upper part of the chip module, wherein the chip cooling base and a closed type spiral pulsation heat pipe are tightly matched to enable an evaporation section of the closed type spiral pulsation heat pipe to be in full contact with the chip module; the evaporation section of the closed type spiral pulsation heat pipe is embedded into the chip cooling base; a cooling fan bracket is fixed on the side face of the chip cooling base; a cooling fan is fixed on the cooling fan bracket; and the cooling fan is positioned at the upper part of a condensation section of the closed type spiral pulsation heat pipe. Rapid export of the heat generated in the operating process of the high-power chips is realized by utilizing the phase changing process of the working medium in the closed type spiral pulsation heat pipe, and the heat is rapidly radiated to the surrounding environment by the cooling fan, so that the high-speed steady operation of the high-power chips can be ensured within a normal temperature range; and in addition, the pulsation heat pipe radiating apparatus has the advantages of simple structure, steady operation, low energy consumption, high radiating heat flow density, high radiating efficiency, and the like.
Description
technical field [0001] The invention relates to the technical field of efficient cooling of high-power chips, in particular to a pulsating heat pipe cooling device for chip cooling. Background technique [0002] With the current development of chip technology integration, miniaturization, and high-frequency and high-speed development, the heating power per unit area of the chip is getting higher and higher, and the temperature is getting higher and higher, but the failure rate of high-power chips is also affected by the temperature. Significantly improved, so chip cooling technology plays a very important role in chip development. [0003] The cooling module design of the chip should mainly consider its occupied space, cooling efficiency and production cost, so as to ensure that the temperature of the chip can be maintained within its normal operating temperature range during use. Among the existing chip cooling technologies, the main heat dissipation methods are divided ...
Claims
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IPC IPC(8): H01L23/427H01L23/467
CPCH01L23/427H01L23/467
Inventor 高建民唐瑞史晓军李法敬徐亮李云龙
Owner XI AN JIAOTONG UNIV