Packaging base of camera module chip and processing method thereof
A camera module and processing method technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of injection molding, which is difficult to process, cannot meet the strength requirements of blue glass, and is not strong enough to improve heat dissipation. Function, reduced thickness, and the effect of using more space
Active Publication Date: 2016-06-08
SUZHOU GYZ ELECTRONICS TECH CO LTD
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- Application Information
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Problems solved by technology
[0003] At present, the position where the blue glass is pasted next to the window hole of the chip package base in the mobile phone camera module can only be as thin as 0.15mm by injection molding process. If it is thinner, it will be difficult to process it by injection molding, or It can be processed, but due to insufficient strength, it cannot meet the strength requirements of the blue glass and the strength requirements of the module, so it is necessary to find a new process to meet the technical requirements.
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[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention.
[0027] The invention discloses a camera module chip packaging base and a processing method thereof, which are used to reduce the thickness of the position where the blue glass is pasted next to the window hole and improve the camera module under the premise of ensuring the packaging strength of the camera module chip packaging base. The heat dissipation function of the chip package base.
[0028] to combine figure 1 , figure 2 , image 3 , Figure 4 As shown, the present invention discloses a camera module chip package base and its processing method, the camera module chip package base includes a first connector 1 and a second connector 2 formed in the first connector 1 , wherein the first connecting part 1 is the main structure of the base, which is preferably a plastic part, an...
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Abstract
The invention discloses a packaging base of a camera module chip and a processing method thereof. The packaging base of the camera module chip comprises a first connecting piece and a second connecting piece formed inside the first connecting piece. The first connecting piece and the second connecting piece are provided with windowing holes. The first connecting piece and the second connecting piece form an integrated piece in an embedded injection molding mode. The first connecting piece is a base body and preferentially a plastic component. The second connecting piece is preferentially a metal piece with the thickness equal to or smaller than 0.15 mm. The packaging base of the camera module chip is designed to be the first connecting piece and the second connecting piece, the thickness of the windowing blue glass attaching position of the packaging base of the camera module chip is decreased, the packaging strength of the camera module chip is improved, and meanwhile the radiating function of the camera module is improved.
Description
technical field [0001] The invention relates to a chip packaging base, in particular to a camera module chip packaging base integrated with plastic and hardware and a processing method thereof. Background technique [0002] At present, the chip package base in the mobile phone camera module is a pure plastic base obtained by injection molding. Since mobile phones are getting thinner and thinner, the available space for the camera module is getting smaller and smaller. The thickness requirement of the chip package base in the module is also getting thinner and thinner. Because the chip packaging base in the mobile phone camera module needs to be attached to the blue glass by IR to form an H / R component (the chip packaging base in the camera module is formed by pasting the base and the blue glass together with a specific glue by patching) Components), the requirements for the space and strength of the chip package base in the mobile phone camera module are getting higher and ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/13B29C45/14H01L23/367H01L21/56H01L21/58
CPCB29C45/14H01L21/56H01L23/13H01L23/367H01L24/80
Inventor 刘文柏
Owner SUZHOU GYZ ELECTRONICS TECH CO LTD