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Structure substrate of COB light source modules with flip LED chips

A technology of LED chips and light source modules, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of low efficiency and low utilization rate of COB light sources, so as to facilitate the dissipation of heat, improve efficiency, and optimize synergy The effect of the work effect

Inactive Publication Date: 2016-06-08
GUANGDONG HHH OPTOELECTRONICS TECH CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For high-power light sources with a power generally between 50W and 250W, such as high-power LED street lights, LED tunnel lights, LED floodlights, LED explosion-proof lights, LED industrial and mining lights, etc., multiple low-power COB light sources are often combined to achieve Reach the specified power requirements, but the COB light sources in the prior art are often too concentrated, not only will generate a large amount of heat accumulation, but also block each other between the COB light sources, so that the efficiency of the COB light source is not high, that is, the utilization rate is not high

Method used

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  • Structure substrate of COB light source modules with flip LED chips
  • Structure substrate of COB light source modules with flip LED chips

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Embodiment Construction

[0020] figure 1 It is a structural schematic diagram of a specific embodiment of the present invention; figure 2 Yes figure 1 side view. refer to figure 1 and figure 2 , the present invention provides a COB light source module structural substrate with flip-chip LED chips, the substrate is provided with several COB light source modules 1, and a plurality of flip-chip LED chips 2 are packaged on the COB light source module 1 , the distance between adjacent LED chips 2 is greater than the thickness of the LED chips 2 .

[0021] In the above-mentioned embodiment, since the distance between adjacent LED chips 2 is greater than the thickness of the LED chips 2, the defect that the COB light sources are arranged too concentratedly is avoided, which is conducive to the dissipation of heat, and at the same time, the LED chips are also optimized to a certain extent. 2 The synergistic effect between each other makes the side of each LED chip 2 emit all the light as much as possib...

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Abstract

The invention discloses a structure substrate of COB light source modules with flip LED chips. The substrate is provided with a plurality of COB light source modules, multiple flip LED chips are encapsulated on the COB light source modules, and the spacing distance between every two adjacent LED chips is larger than the thickness of the LED chips. According to the COB light source module structure substrate of the flip LED chips, due to the fact that the space distance between every two adjacent LED chips is larger than the thickness of the LED chips, the defect that COB light sources are arranged too densely is avoided, heat emission is facilitated, and meanwhile the cooperative work effect among the LED chips is optimized to a certain degree; the side edge of each LED chip is made to emit complete light as far as possible, and therefore the efficiency of the COB light sources is improved.

Description

technical field [0001] The invention relates to a COB light source structure, in particular to a COB light source module structure substrate with flip-chip LED chips. Background technique [0002] The COB light source can be simply understood as a high-power integrated surface light source, which is a high-efficiency integrated surface light source technology in which LED chips are directly attached to a high-reflection mirror metal substrate. The product features of the COB light source are: electrical stability, circuit design, and optical design. , The heat dissipation design is scientific and reasonable; the use of heat sink technology ensures that the LED has an industry-leading thermal lumen maintenance rate (above 95%); it is convenient for the secondary optical matching of the product to improve the lighting quality; high color rendering, uniform light emission, no spot, Healthy and environmentally friendly; easy to install, easy to use, reduce the difficulty of lamp...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48
CPCH01L25/0753H01L33/486
Inventor 冯挺王忆杨华王振兴杨涛
Owner GUANGDONG HHH OPTOELECTRONICS TECH CO LTD
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