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Improved construction kit of modular circuit elements

A circuit element and modular technology, applied in the field of modular circuit elements, can solve the problems of maintaining the stability of the bonding state, high manufacturing cost, module falling off, etc., achieve simple replacement of bonding and separation, effective electrical connection and contact, and reduce manufacturing costs. cost effect

Inactive Publication Date: 2016-06-08
康民洙
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned prior literature discloses a modular circuit element structure kit that can solve the existing problems, because the module shell and the wire connection module of the modular circuit element are respectively equipped with a male connector and a female connector. The structure of combining various modular circuit elements has disadvantages such as difficulty in making the shape, high manufacturing cost, and easy to cause the modules combined in the middle position to fall off when combining more modules, making it difficult to maintain a stable structure. combined state
Therefore, in order to solve the problem of maintaining the stability of the bonding state and many problems in the shape production in the existing bonding methods of the prior literature, the applicant provides a modular circuit element structure kit with an improved structure

Method used

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Embodiment Construction

[0070] Below, preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, so that those skilled in the art can easily implement the present invention. In the process of describing the preferred embodiments of the present invention in detail, if it is considered that the specific description of well-known related functions or structures may make the gist of the present invention unclear, the relevant detailed description will be omitted. In addition, the same symbols are used in all the drawings for parts that perform similar functions or roles.

[0071] It should be noted that when it is stated in the entire specification that a certain part is "connected" to other parts, it includes not only the case of "direct connection" between the two, but also the case of "indirect connection" including other elements between the two. In addition, the description of "comprising" a certain constituent element does not mean the exclusion ...

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Abstract

According to an improved construction kit of modular circuit elements provided by the present invention, the individual circuit elements for forming an electronic circuit are formed in the shape of a module, and the circuit elements are configured to be connected to a square or rectangular circuit element block module by an I-shaped or H-shaped circuit element coupling module for an electrical connection such that the electrical connection of the electronic circuit for testing a circuit and a coupled state between the modules can be stably maintained.

Description

technical field [0001] The present invention relates to an improved structural kit of modular circuit elements, in particular to a modularized independent circuit element which constitutes an electronic circuit and ensures effective communication between block-shaped square or rectangular circuit element block modules. Modular circuit element modified construction kits that make electrical connections contact and maintain a firm bond to provide effective electronic circuit structures for circuit experiments. Background technique [0002] Currently, general circuit components used to configure circuits include two types. That is, general circuit components are classified into deep type components and SMD type components. Among them, the SMD type is mainly used for commercial purposes, and the required circuit board is made through the SMT operation of the PCB. In contrast, the deep type is usually used for larger equipment or experimental purposes. [0003] This existing S...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09B23/18H05K7/02H01R12/51
CPCG09B1/325G09B23/18G09B23/185H01R12/51H05K7/02
Inventor 康民洙吴宗河
Owner 康民洙
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