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Temperature uniformizing board

A technology of vapor chamber and cover plate, which is applied in the direction of lighting and heating equipment, indirect heat exchangers, etc., which can solve the problems of easy damage or perforation, and affect the heat conduction efficiency, so as to improve the pass rate, improve the heat conduction efficiency, and reduce the heat transfer efficiency. The effect of the probability of leakage

Active Publication Date: 2016-06-15
AURAS ELECTRONICS SCI & TECH IND KUNSHAN
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the existing vapor chamber is easily damaged or broken during the process of cutting and welding because the injection pipe is only sleeved between the two cover plates during the sealing process, and it is easy to cause bruises during the handling process. Due to the situation, the probability of leakage is increased, which affects the heat conduction efficiency. The main purpose of the present invention is to provide a vapor chamber. The present invention mainly uses a sleeve to cover the injection pipe, and the sleeve can provide the injection pipe during sealing welding. The supporting force can reduce the chance of the injection pipe being damaged or broken, and it can reduce the degree of collision of the injection pipe during the handling process, thereby greatly reducing the leakage probability of the fluid in the chamber and improving the manufacturing process of the chamber Pass rate

Method used

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Embodiment Construction

[0044] In order to understand the technical features and practical effects of the present invention in detail, and to realize them according to the content of the invention, the preferred embodiment shown in the figure is further described in detail as follows:

[0045] The first preferred embodiment of the vapor chamber provided by the present invention, such as Figure 1 to Figure 3 As shown, the vapor chamber includes a lower cover 10, an injection pipe 20, an upper cover 30 and a casing 40, wherein:

[0046] The lower cover plate 10 is a plate body made of metal with high ductility and high thermal conductivity, such as metals such as copper or gold. The lower cover plate 10 includes a lower joint portion 11 and a lower capillary portion 12. The lower joint portion 11 The ring is formed on the periphery of the lower cover plate 10, so that the lower joint portion 11 is a ring surface, and one side of the lower cover plate 10 forms a lower positioning portion 13 within the ...

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Abstract

The invention provides a temperature uniformizing board which comprises a lower cover plate, an injection pipe, an upper cover plate and a sleeve. The injection pipe penetrates between the lower cover plate and the upper cover plate. Mainly, the sleeve is arranged on the injection pipe in a sleeving mode, and the sleeve provides supporting force in the sealing weld process of the injection pipe, so that the injection pipe is not prone to being damaged or perforated in the sealing weld process, and the probability of leakage is lowered due to the fact that the injection pipe is not prone to collision damage in the carrying process; the percent of pass of the temperature uniformizing board can be increased.

Description

technical field [0001] The invention relates to a plate-shaped cooling device, in particular to a uniform temperature plate. Background technique [0002] Today's electronic products require lightness and high performance, so electronic components need to generate high-power calculations in a very small volume range and in a short period of time. Therefore, the high temperature of existing electronic products is usually concentrated in a specific area during operation to generate heat. Accumulation (heataccumulation) phenomenon, and because the vapor chamber is filled with a fluid that can evaporate and condense, it has good heat conduction efficiency, and the vapor chamber is thin and lightweight, so the vapor chamber is gradually used in the field of electronic products in place of heat sinks, such as Figure 7 As shown, the existing vapor chamber includes an upper cover plate 70, a lower cover plate 80, and an injection pipe 90. During manufacture, the injection pipe 90 i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/0233F28D15/046
Inventor 吴安智陈志伟陈家祥郭晋宏
Owner AURAS ELECTRONICS SCI & TECH IND KUNSHAN