A method for mapping silicon wafer boxes inside a storage device
A storage device, silicon wafer box technology, applied in the directions of transportation and packaging, electrical components, conveyor objects, etc., can solve problems such as increasing the maintenance and management cost of the Stocker, increasing the workload, and increasing the complexity of the Stocker structure, so as to reduce the complexity. , reduce workload, reduce the effect of repetitive actions
Active Publication Date: 2018-10-16
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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[0006] In the above-mentioned existing Stocker, it is necessary to install a pressure sensor at each storage position. Like this, each Stocker needs to install at least hundreds or even hundreds of pressure sensors, which not only increases the structural complexity of the Stocker, but also increases the maintenance and maintenance of the Stocker. When installing and debugging, each sensor needs to be debugged one by one. These repetitive actions increase the workload, which also increases the maintenance and management cost of Stocker.
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[0028] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0029] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.
[0030] In the following specific embodiments of the present invention, please refer to image 3 , image 3 It is a flow chart of a method for mapping silicon wafer cassettes inside a storage device according to the present invention. Such as image 3 As shown, a storage device internal silicon cassette mapping method of the present invention compr...
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The invention discloses a mapping method for silicon wafer boxes inside a storage device. The mapping method comprises the following steps: building a standard reference graph of an overall storage status of storage positions in the storage device; taking a picture of an actual overall storage status of the storage positions; comparing an obtained actual storage status graph of the storage positions with the standard reference graph to obtain a mapping graph of occupation and idle storage statuses of all the storage positions; and transmitting information about the mapping graph to a material control system. Through adoption of the mapping method, a hundred of or even hundreds of pressure sensors can be omitted in each storage device; the workload can be reduced during maintenance of equipment and installing and debugging; and repeated debugging actions of the sensors are reduced. Thus, the complexity and the cost of the storage device can be lowered.
Description
technical field [0001] The present invention relates to the technical field of material transmission equipment in semiconductor processing, and more specifically, to a mapping method for silicon wafer boxes inside a storage device. Background technique [0002] With the development of semiconductor technology, 300mm silicon wafers have gradually replaced 200mm silicon wafers as mainstream products, and the weight of each box of silicon wafers loaded with silicon wafers has also increased from about 4 kg to about 9 kg. In this situation, if manual handling of silicon wafer boxes is still carried out by manpower, not only will the production efficiency be reduced, but there will also be potential safety hazards causing personal injury to the transporters. At the same time, semiconductor manufacturing plants have increasingly stringent requirements on plant utilization and production cycle. Therefore, semiconductor manufacturing plants have begun to use a large number of autom...
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67259H01L21/6773
Inventor 李佳青
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT