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A kind of manufacturing method of pcb with edge metallization

A production method and metallization technology, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve problems such as broken boards and scrapped, and reduce the effect of being broken

Active Publication Date: 2018-10-02
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the existing board edge metallized PCB manufacturing method is prone to broken boards and scrapped during the electroplating process, and provides a board edge metallized PCB manufacturing method that can avoid the connection position being broken during the electroplating process

Method used

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  • A kind of manufacturing method of pcb with edge metallization
  • A kind of manufacturing method of pcb with edge metallization

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Experimental program
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Effect test

Embodiment

[0021] This embodiment provides a method for fabricating a PCB with metallization on the edge of the board, which can reduce the possibility of the connection location being broken during the electroplating process.

[0022] The specific production steps are as follows:

[0023] (1) Multilayer board

[0024] According to the prior art, the inner layer circuit (to form the core board) is made through the cutting → negative film process → pressing, and the base material is made into an undrilled multilayer board, that is, the inner core board, the prepreg and the outer copper The foil is laminated to form an integral board; the multi-layer board produced includes a plurality of areas for making unit boards, which are called unit board areas.

[0025] (2) Drilling

[0026] Use the drilling data to drill circuit holes on the multilayer board, and gong multiple board edge grooves along the periphery of the unit board area in the multilayer board. The board edge grooves are rectangular and l...

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PUM

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Abstract

The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a PCB with edge metallization. The present invention adjusts the sequence of making the board edge groove and the stamp hole, and drills the stamp hole after pattern electroplating, which can avoid the problem that the connecting position is easily broken in the electroplating process after the stamp hole is drilled. The end of the edge groove of the plate is arranged in a square shape, which can make the area of ​​the connection position relatively larger compared with the circular shape in the prior art, and further reduce the possibility of the connection position being broken during the electroplating process. According to the thickness of the board, setting the connection positions of different sizes and the hole margins between the stamp holes can further reduce the possibility of the connection positions being broken during the electroplating process.

Description

Technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a PCB with metallized edges. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. The PCB production process is generally as follows: cutting → inner layer pattern → inner layer etching → inner layer AOI → browning → pressing → drilling → copper sinking → full board plating → outer layer pattern → pattern plating → etching → outer layer AOI→silk screen solder mask, characters→surface treatment→forming→electrical test→FQC→packaging. Among them, in order to improve efficiency and facilitate production, when cutting materials, multiple unit graphics (units) are put together to form a set of module graphics (set), and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/1453
Inventor 罗家伟白会斌胡志勇叶文钰
Owner JIANGMEN SUNTAK CIRCUIT TECH