Multi-layer sealed case having a plurality of hollow tapered cooling channels

A technology of multi-layer sealing and heat dissipation air duct, which is applied in the field of machinery and circuits, can solve the problems of high temperature heat dissipation and high heat density of sub-systems, and achieve good high and low temperature effects

Active Publication Date: 2016-06-22
CNGC INST NO 206 OF CHINA ARMS IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of high temperature heat dissipation and local high heat density of each sub-system in the existing cabinet, the present invention proposes a multi-layer sealed cabinet with multiple hollow conical cooling air ducts

Method used

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  • Multi-layer sealed case having a plurality of hollow tapered cooling channels
  • Multi-layer sealed case having a plurality of hollow tapered cooling channels
  • Multi-layer sealed case having a plurality of hollow tapered cooling channels

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Embodiment Construction

[0020] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0021] Considering that there are many modules that need heat dissipation inside the box, and the heat dissipation installation surface of the modules is relatively large, the box uses two independent sealed air ducts for heat dissipation. In view of the connection relationship between the modules, attach the signal office, power supply and wave control to one sealed air duct, and attach the TR components and microwave to another sealed air duct. In order to facilitate the engineering realization, the conical cooling fins in the height and length directions are installed on the chassis in the form of parts. Since the components that need heat dissipation on the printed board are of different heights, it is inconvenient to directly process these pads on the chassis, and it will also It is disassembled into part form. The air duct is sealed with an air duct cover ...

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Abstract

The invention relates to a multi-layer sealed case having a plurality of hollow tapered cooling channels. An antenna cover, a rear cover plate, a left cover plate and a right cover plate, and an upper cover plate and a lower cover plate are sealed at an outermost layer of a transmitting-receiving case; an outer layer cavity structure reserved by the transmitting-receiving case structure forms a third-layer sealing cavity; a left inner air-duct sealing plate and a right inner air-duct sealing plate are installed at left and right inner air-duct cavity mounting end surfaces reserved at the transmitting-receiving case structure to form first layer sealing cavities; and the transmitting-receiving case structure is sealed by the rear cover plate to form a second layer cavity for installing all sub systems. The first layer sealed cavities are hollow cooling channels are distributed in a left-right symmetric mode by inner air-duct tapered left fins and inner air-duct tapered right fins; and unique hollow tapered air ducts are formed at the height and length directions of the cooling fins. All sub systems inside the transmitting-receiving case are attached to external surfaces of a left inner air duct and a right inner air duct by heat-conduction pads; heat of all sub systems is transmitted to inner surface cooling fins of the left inner air duct and the right inner air duct with low thermal resistance; and then the heat is taken away by forced convection of a motor.

Description

technical field [0001] The invention belongs to the two fields of machinery and circuits, and relates to a multi-layer sealed cabinet with a plurality of hollow conical cooling air ducts. The antenna, TR components, wave controller, power divider, microwave, signal office and power module of a certain radar are installed in the chassis. The working environment of the radar has high and low temperature, vibration, shock and other requirements. The structure of the radar chassis adopts integrated heat dissipation and multi-layer sealing technology, which enhances the working ability of the radar in harsh environments. [0002] The TR components in the radar transceiver box have a high heat density, and the wave control, signal processing, microwave modules, and power supply all have high heat dissipation requirements. Due to the harsh installation and use environment of the radar, each subsystem needs to work in a closed environment. This chassis solves the problems of integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S7/02H05K5/06H05K5/02H05K7/20
CPCG01S7/02H05K5/0213H05K5/061H05K7/20145
Inventor 方伟奇冯健康黄根全谢敏董亮张波贾江涛张占锋
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP
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