Multi-layer sealed case having a plurality of hollow tapered cooling channels
A technology of multi-layer sealing and heat dissipation air duct, which is applied in the field of machinery and circuits, can solve the problems of high temperature heat dissipation and high heat density of sub-systems, and achieve good high and low temperature effects
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[0020] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:
[0021] Considering that there are many modules that need heat dissipation inside the box, and the heat dissipation installation surface of the modules is relatively large, the box uses two independent sealed air ducts for heat dissipation. In view of the connection relationship between the modules, attach the signal office, power supply and wave control to one sealed air duct, and attach the TR components and microwave to another sealed air duct. In order to facilitate the engineering realization, the conical cooling fins in the height and length directions are installed on the chassis in the form of parts. Since the components that need heat dissipation on the printed board are of different heights, it is inconvenient to directly process these pads on the chassis, and it will also It is disassembled into part form. The air duct is sealed with an air duct cover ...
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