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Wafer Yield Judgment Method and Wafer Qualification Test Multivariate Detection Method

A detection method and multi-variable technology, applied in semiconductor/solid-state device testing/measurement, etc., can solve problems such as difficulty in finding out WAT parameters, manual confirmation, difficulty in correlation, etc., and achieve the effect of saving test cost and reducing detection time

Active Publication Date: 2019-05-07
WINBOND ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the types of WAT parameters are very complicated and may reach more than 300. It is not easy to find problems in WAT parameters manually
On the other hand, different WAT parameters may be correlated with each other; when a certain parameter is out of the preset range, other parameters related to this parameter may also be out of the preset range, but this correlation is difficult to pass easily. Manpower Confirmation
Therefore, if the WAT parameters are detected manually, it will take a lot of manpower and precious time

Method used

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  • Wafer Yield Judgment Method and Wafer Qualification Test Multivariate Detection Method

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Embodiment Construction

[0026] figure 1 A flowchart showing a wafer yield judgment method according to an embodiment of the present invention. Please refer to figure 1 The so-called wafer is the carrier and material used in the semiconductor manufacturing process to make semiconductor integrated circuits. Each wafer on the wafer is a product of the semiconductor manufacturing process. In order to save labor costs, the method for judging the yield rate of wafers and the multivariate detection method for wafer qualification testing described in the embodiments of the present invention can be presented in the form of software (for example, application programs), and equipped with better hardware The electronic equipment of the standard can execute this software, thereby realizing the embodiment of the present invention. This software can also be recorded on non-volatile readable media, such as optical discs, removable hard disks and other devices. Those who apply this embodiment can also implement t...

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Abstract

The invention provides a yield determination method of a wafer and a multivariate detection method of a wafer acceptance test. The yield determination method includes: conducting the wafer acceptance test of a to-be-tested wafer to generate a plurality of characteristic parameters; grouping the characteristic parameters according to a correlation list to form multiple groups of characteristic parameter groups; calculating analysis values corresponding to one or the combination of the characteristic parameters in each characteristic parameter group in the manner of multivariate analysis, and determining whether the analysis values are greater than preset specification information corresponding to the one or the combination of the characteristic parameters in order to regard one or the combination of the characteristic parameters corresponding to the analysis values greater than the preset specification information as at least one characteristic parameter beyond the specification; and determining the yield of the to-be-tested wafer according to the characteristic parameters beyond the specification.

Description

technical field [0001] The present invention relates to a wafer inspection technology, and in particular relates to a wafer yield judgment method using wafer acceptance test (WAT for short) and the multivariable method of wafer acceptance test (Multiple variable) detection method. Background technique [0002] During semiconductor fabrication, wafer qualification testing (WAT) is commonly used to perform electrical testing on wafers. WAT will generate many electrical parameters and values. Users can use these electrical parameters and values ​​to evaluate the yield of the wafer under test and discover possible problems in the semiconductor manufacturing process. If the abnormal WAT parameters can be found early, it can have a decisive impact on the decision-making of wafer manufacturing, the evaluation of whether the wafer needs to be scrapped, and whether it will be shipped to the customer. [0003] As far as the current technology is concerned, the electrical parameters ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
Inventor 邱智扬詹凯茹王宪盟郭年益
Owner WINBOND ELECTRONICS CORP