Circuit board screen printing alignment judging method and structure

Abstract

The invention discloses a circuit board screen printing alignment judging method and structure. The circuit board screen printing alignment judging method includes a prefabrication step and a screen printing plate alignment judging step. In the prefabrication step, a substrate is provided, and a substrate window is arranged on the substrate; a screen printing plate is provided, after the screen printing plate is aligned with the substrate, a screen printing window corresponding to the substrate window is arranged on the screen printing window, the area of the screen printing window is smaller than that of the substrate window, and when ink is printed on the screen printing window, ink can completely drop in the substrate window. In the screen printing plate alignment judging step, the screen printing plate is arranged on the substrate, and ink is printed on the screen printing plate window; and the condition of ink on the substrate in observed, if ink completely drops in the substrate window, the screen printing plate is judged to be accurate in alignment, and if ink does not completely drop in the substrate window, the screen printing plate is judged to be inaccurate in alignment. In actual production, the condition of alignment of the substrate and the screen printing plate is judged through observation of whether the printing ink completely drops in the substrate window, and the operation is easy and direct.

Description

Technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method and structure for judging the alignment of circuit board screen printing. Background technique [0002] In the circuit board production process, after the outer layer circuit is finished, the outer layer circuit must be treated with solder protection to prevent the outer layer circuit from oxidation or welding short circuit. The commonly used solder mask method is to first pre-process the copper surface of the circuit board, and then use screen printing to print a layer of solder mask ink on the circuit board, and then undergo pre-bake, exposure, development, and post-bake treatments to achieve the Solder protection for circuit boards. [0003] The screen printing method has higher requirements for the operator's screen alignment ability. When the screen alignment is misaligned, it is easy to cause false copper exposure and oil accumulation in the tool hole...

AI Technical Summary

Problems solved by technology

[0003] The screen printing method has high requirements on the screen registration ability of the operator. When the screen registration deviation occurs, it is easy to cause false copper exposure and oil accumulation in the tool hole.

Screen alignment usually requires the accumulation of experience. If the operator is inexperienced, the alignment time will be longer, and the possibility of alignment deviation is greater, which is not only time-consuming and laborious, but also the effect is not good

Before mass production, in the process of adjusting the screen, employees usually confirm whether the alignment is good by observing the false copper exposure and solder mask oil accumulation next to the tool hole. This observation method has a certain degree of blindness and is prone to errors. Judgment, affecting product quality and production efficiency

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