High-precision bonding device and method based on ccd detection
A lamination device, high-precision technology, applied in lamination devices, chemical instruments and methods, lamination and other directions, can solve problems such as low production efficiency, reduced product yield, and difficulty in effectively guaranteeing product accuracy and stability. Improve lamination efficiency and high degree of automation
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[0021] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be further described in detail below in conjunction with the drawings and specific embodiments.
[0022] Such as image 3 As shown, the present invention provides a high-precision bonding device based on CCD detection, including a product material tape supply mechanism (not numbered in the figure) for supplying a product material tape 80 to be labeled, a label material for supplying a label material tape Tape supply mechanism (not shown in the figure), laminating platform 3, suction label and labeling mechanism 4 for sucking and laminating labels, first CCD assembly 5 for taking images of product strips, arranged on the The second CCD assembly 6 and the controller 7 are placed above the label station to take pictures of the labels sent by the label material tape supply mechanism....
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