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Through hole depth measuring device and drilling machine

A technology of depth measurement and thickness measurement, applied in the field of measurement, can solve problems such as affecting the quality of circuit boards, inaccurate processes, and inaccurate testing

Active Publication Date: 2018-05-01
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the through-hole measurement device in the related art needs to meet the conditions of electrical signal inductance, which will lead to inaccurate testing due to defects in the metal layer in the back-drilled hole, and thus produce test false points, which will lead to inaccurate subsequent processes. , which in turn affects the overall quality of the board

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  • Through hole depth measuring device and drilling machine
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Embodiment Construction

[0027] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0028] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0029] figure 1 A schematic structural diagram of a depth sensor according to an embodiment of the present invention is shown; figure 2 A schematic structural diagram of a through-hole depth measu...

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Abstract

The present invention provides a through-hole depth measuring device and a drilling machine, wherein the through-hole depth measuring device includes: a thickness sensing module for measuring the thickness of the plate; a depth sensing module for measuring The depth of the first type of through hole; the microprocessor, connected to the thickness sensing module and the depth sensing module, is used to calculate the thickness according to the difference between the thickness of the plate and the depth of the first type of through hole Determine the depth of the back drilled hole. Through the technical scheme of the invention, the accurate measurement of the through hole of the plate is realized, and the situation that the traditional through hole depth measuring device produces a false point in measuring the through hole due to the misconduction of the electric signal is avoided.

Description

technical field [0001] The invention relates to the technical field of measurement, in particular to a through-hole depth measuring device and a drilling machine. Background technique [0002] With the reduction of circuit board line width and through holes, the requirements for the quality and dimensional accuracy of through holes of boards such as circuit boards are increasing. [0003] In the related art, the commonly used through-hole measurement device includes a probe, a joint end and a path determination device, wherein the probe and the joint end are respectively connected in series with the path determination device through wires, the probe is cylindrical, and The diameter of the probe is smaller than the diameter of the back-drilled hole. The measuring device is used to measure the back drilling depth by the length of the probe penetrating into the back drilling hole when the measuring device forms a conducting path with the copper layer in the back drilling hole ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/18
Inventor 李小晓舒明
Owner NEW FOUNDER HLDG DEV LLC