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Detection system of BGA chip

A detection system and chip detection technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as hidden dangers in operation safety, and achieve the effect of ensuring safety and convenient operation

Active Publication Date: 2016-06-29
深圳市比亚泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the above two solutions have the following problems: after the detection is completed, the position of extracting the BGA chip is under the pressure plate, so there is a hidden danger of operation safety

Method used

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  • Detection system of BGA chip
  • Detection system of BGA chip
  • Detection system of BGA chip

Examples

Experimental program
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Embodiment Construction

[0023] Such as Figure 1 to Figure 6 As shown, a detection system of a BGA chip includes a frame 10, a BGA chip positioning mechanism 30, a platen mechanism 20 and a BGA chip detection mechanism 40; it is characterized in that: the frame 10 includes a base plate 11, four support columns 12 and the cylinder mounting plate 13; the base plate 11 is a square plate; the support column 12 is vertically fixed on the four corners of the base plate 11; the cylinder mounting plate 13 is fixed on the upper end faces of the four support columns 12; The platen mechanism 20 includes a cylinder 21 and a platen 22; the cylinder 21 is arranged vertically downward; the cylinder 21 is fixed at the center of the lower end face of the cylinder mounting plate 13; the piston rod of the cylinder 21 is fixed with a platen 22; The BGA chip positioning mechanism 30 includes a positioning plate 32, a support frame 31 and a positioning cylinder 35; the upper end surface of the base plate 11 is provided wi...

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PUM

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Abstract

The invention discloses a detection system of a BGA chip. The system comprises a rack, a BGA chip positioning mechanism, a pressing plate mechanism and a BGA chip detection mechanism. The rack comprises a base plate, four support posts and a cylinder mounting plate. The base plate is a square plate. The support posts are vertically fixed at four corners of the base plate. The cylinder mounting plate is fixed on the upper end faces of the four support posts; the pressing plate mechanism comprises a cylinder and a pressing plate. The cylinder is arranged vertically downward; the cylinder is fixed at the center of the lower end face of the cylinder mounting plate; and the BGA chip detection mechanism is arranged on the base plate of the rack. The system has the advantages that the BGA chip is placed and extracted at the outer side of the rack, rather than under the pressing plate mechanism, in this way, it is convenient for a worker to operate, and the security of the worker can be ensured.

Description

technical field [0001] The invention relates to the field of BGA chips, in particular to a BGA chip detection system. Background technique [0002] Because the thickness of BGA-packaged chips (referred to as BGA chips) is more than 1 / 2 less than that of ordinary QFP, the weight is reduced by more than 3 / 4, and at the same time, it can improve the electrothermal performance, the parasitic parameters are small, the signal transmission delay is small, and it can adapt to a wide range of frequencies and can be assembled. Coplanar welding features high reliability, so it is widely used in high-density, high-performance, multi-pin integrated circuits such as CPU, motherboard south and north bridge chips, and portable mobile terminals that require high volume and quality, such as tablet computers and PADs Wait. [0003] Existing BGA chips are inspected after welding to avoid defective products caused by missing soldering and false soldering. At present, the BGA chip soldering ins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/00H01L22/30
Inventor 董芬芳
Owner 深圳市比亚泰科技有限公司