A parallel clamping type large-scale electronic component sticking and inserting operation head and its sticking and inserting method
A clamping technology for electronic components, applied in the field of parallel clamping large-scale electronic component placement and insertion operation head and its insertion field, can solve the problem that it is difficult to ensure the insertion of large electronic components, affecting the insertion speed of the placement machine, and the placement Insertion accuracy and work efficiency and other issues, to achieve the effect of increasing the speed of insertion and insertion, and improving the accuracy of insertion and insertion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0046] Example: such as Figure 1 to Figure 3 As shown, a parallel clamping type large-scale electronic component insertion operation head includes a plug support 1, a timing belt device-2 arranged on one end of the plug support 1, and a control for driving the timing belt device-2. Motor one 3 (synchronous belt device one 2 comprises drive wheel one, driven wheel one and synchronous belt one 211), the L-shaped slide block 4 that is fixed on the synchronous belt one 211 of synchronous belt device one, is arranged on the L-shaped slide block The clamping cylinder 5 on 4 and the timing belt device 2 6 arranged on the other end of the plug support 1 and the control motor 2 7 for driving the timing belt device 2 6 (the timing belt device 2 includes driving wheel 2, driven wheel Two 611 and timing belt two);
[0047] The parallel clamping type large-scale electronic component insertion operation head also includes a ball spline assembly and a parallel clamping chuck 9 for clamping...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com