Thick Film Chip Resistor Construction

Abstract

The invention discloses a thick-film chip resistor structure, which is mainly based on the premise of maintaining the conventional 2512 chip resistor, by increasing the thickness of the substrate, increasing the number of layers of the upper electrode unit, and increasing the number of layers of the protection unit. 1. Expand the area of ​​the lower electrode unit and expand the area of ​​the resistance layer, thereby effectively increasing the heat dissipation volume of the overall resistor, and then significantly increasing the overall power, so that the present invention can provide higher power in the same size specification and improve applicability. And can create higher economic benefits.

Description

technical field [0001] The present invention relates to the structure of thick film chip resistors, which is related to the structure of the resistors. Background technique [0002] The chip resistors of passive components can be divided into two categories: thick-film resistors and thin-film resistors according to different manufacturing processes; thin-film resistors are produced by sputtering. Thick film resistors are printed and sintered to make resistive films; the main difference between thick film resistors and thin film resistors is the tolerance of precision errors, and users can choose different resistors according to product requirements. [0003] In addition to the difference in precision, chip resistors also have differences in size specifications. Common resistor codes are represented by four digits, such as 0402, 0606, 0805 or 2512, which represent the length and width of the resistor. , the first two digits are the length (inches) of the resistor, and the la...

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Problems solved by technology

[0004] The resistance value of the chip resistor can be directly represented by the three-digit code on the appearance of the chip resistor body, and the resistance value of the chip resistor is mainly obtained by printing a resistance layer on the surface of the ceramic substrate to obtain a rough initial value of the resistance value. Subsequent laser trimming is necessary to obtain the required precise resistance value. The method of resistor laser trimming is mainly to trim the surface of the chip resistor, and adjust the resistance value by reducing the cross-sectional area of ​​the chip resistor. Generally, the laser cutting method on the surface of the resistor is to cut an L-shaped incision 11 on the surface of the resistor 10 to adjust the resistance value. However, the L-shaped incision 11 is to destroy the resistance layer in a large area at one time. Accurately grasping the machining accuracy will result in inaccurate resistance values. Of course, obtaining precise resistance values ​​will greatly increase the difficulty of processing and increase production costs at the same time, but there is a lack of economic benefits.

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