Fingerprint collector, manufacturing method therefor, fingerprint collection panel, and display panel

A fingerprint collection and production method technology, applied in the direction of acquiring/arranging fingerprints/palmprints, electric solid-state devices, semiconductor devices, etc., can solve the problems of reduced migration rate, increased threshold voltage, and reduced TFT operating current, etc.

Active Publication Date: 2016-07-20
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, doping, annealing and other processes are required to make photodiodes, which will reduce the switching characteristics of TFTs.
[0006] For example, the temperature used in the annealing process is generally above 650 degrees, and the TFT cann

Method used

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  • Fingerprint collector, manufacturing method therefor, fingerprint collection panel, and display panel
  • Fingerprint collector, manufacturing method therefor, fingerprint collection panel, and display panel
  • Fingerprint collector, manufacturing method therefor, fingerprint collection panel, and display panel

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments.

[0032] In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0033] The fingerprint acquisition device provided by the embodiment of the present invention can be applied to the optical fingerprint acquisition process. In order to more clearly describe the structure and ...

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PUM

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Abstract

The embodiment of the invention provides a fingerprint collector, a manufacturing method therefor, a fingerprint collection panel and a display panel, and relates to the technical field of display. The switching characteristics of a TFT can be guaranteed during the manufacturing of the fingerprint collector. The fingerprint collector comprises a TFT disposed on a substrate, and a photosensitive diode connected with a drain electrode of the TFT. The TFT comprises a grid electrode, an active layer, a source electrode, and a drain electrode. Furthermore, the fingerprint collector also comprises a metal pattern which is opposite to a gap between the source electrode and the drain electrode. The metal pattern is disposed at a side, far from the substrate, of the active layer. An array substrate can be used in a fingerprint collection process.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a fingerprint collection device and a manufacturing method thereof, a fingerprint collection panel and a display panel. Background technique [0002] Photodiode devices can convert optical signals of different light intensities into electrical signals. Therefore, in the optical fingerprint collection technology, the photosensitive characteristics of the photodiode device are usually used to collect the fingerprint information of the subject. [0003] Specifically, the fingerprint collection device may specifically include a TFT (ThinFilmTransistor, thin film transistor) and a photodiode, wherein the cathode of the photodiode can be connected to the TFT, and the anode of the photodiode can be grounded, so that when the TFT is turned on, the photodiode is in reverse bias. state. [0004] When the finger presses the fingerprint collection device, the reflected light intensity of t...

Claims

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Application Information

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IPC IPC(8): H01L27/144G06K9/00
CPCH01L27/1443G06V40/1318
Inventor 刘英明董学薛海林陈小川王海生杨盛际丁小梁王鹏鹏赵卫杰李昌峰刘伟
Owner BOE TECH GRP CO LTD
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